公开(公告)号：DE19627442A1

公开(公告)日：1998-01-22

申请号：DE19627442

申请日：1996-07-08

Applicant: IBM

Inventor： DRUSCHKE FRANK DR ,  ELSNER GERHARD DR ,  GRESCHNER JOHANN DR ,  STOEHR ROLAND

IPC: G01R1/073 ,  F16B11/00 ,  G01R1/067

Abstract: The adhesive joints (1) are made at the surface (2), or within the guide holes (5) of a board, and are at an arbitrary angle in a stack of boards (3) made of silicon, to fit wires, glass fibres or micro-mechanical components permanently. The upper part, or upper layers, of the boards can have elongated holes (5a) to provide an adhesive reservoir, allowing a high viscosity, thixotropic adhesive to be used. The remainder of the holes (5b) are cylindrical, and of smaller size. Hundreds of closely spaced wire contacts, of 25 to 100 micron diameter, can be glued into the boards as test probes for the buckling beam tests.

公开(公告)号：DE3678296D1

公开(公告)日：1991-04-25

申请号：DE3678296

申请日：1986-10-17

Applicant: IBM DEUTSCHLAND

Inventor： DRUSCHKE FRANK DR

IPC: C08J5/08 ,  C03C25/10 ,  C03C25/40 ,  C07F7/18 ,  C08J5/24 ,  C08K9/06 ,  D06M13/02 ,  D06M13/50 ,  D06M13/51 ,  D06M13/513 ,  D06M101/00 ,  H05K1/03 ,  C03C25/02