公开(公告)号：DE3473651D1

公开(公告)日：1988-09-29

申请号：DE3473651

申请日：1984-06-22

Applicant: IBM DEUTSCHLAND ,  IBM

Inventor： ELSASSER MICHAEL ,  STOEHR ROLAND

IPC: G01R1/073

Abstract: The contactor (10) comprises an assembly block attached to a relatively fixed mount by bolts with a degree of emergency overtravel in the 'Z' direction being provided by the spring and bush. The test probes are arranged in a square series of 9 matrices each of which accommodates 285 probes with four probe positions at the corners of each square being occupied by thin stabilising rods. The probe wires (50) slide through a matrix of holes in three guide plates set at predetermined spacings and supported in the frames and the stripper plates supported in frames. Above exit plate, the probe wires converge into bundles leading to cables and within the carrier block are embedded in cast resin.

公开(公告)号：JP2002098713A

公开(公告)日：2002-04-05

申请号：JP2001218755

申请日：2001-07-18

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN DR ,  MEISSNER KLAUS ,  STEINER WERNER ,  STOEHR ROLAND

IPC: G01R31/26 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To provide a contact probe arrangement 1 for connecting electrically a test device to circular contact pads 2 of a device 3 to be tested. SOLUTION: The contact probes 4 are pressed perpendicularly onto the contact pads 2 in order to realize a low contact resistance, and can be bent in the transverse direction in regions 6a, 6b where the contact probes are installed in order to adjust the difference of heights of the contact pads 2 caused by a non-uniform surface of the device 3 to be tested. The contact probes 4 are installed in a guide groove 5. The guide groove 5 and the regions 6a, 6b are formed on a plane parallel to the plane of a guide groove 7, and covered with a protection plate. This constitution assures a contact probe array having a very high density. This kind of contact probe array can be used, for example, for detecting open and short in an electric circuit array of a microelectronic composite device.

公开(公告)号：DE69426522D1

公开(公告)日：2001-02-08

申请号：DE69426522

申请日：1994-06-01

Applicant: IBM

Inventor： STOEHR ROLAND ,  KRATT RUDOLF

IPC: H01B11/00 ,  G01R1/067 ,  G01R1/073 ,  H01B11/18 ,  H01P3/06

公开(公告)号：GB2306804B

公开(公告)日：1999-07-14

申请号：GB9621500

申请日：1996-10-16

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  MEISSNER KLAUS ,  STOEHR ROLAND ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

公开(公告)号：DE19625493C1

公开(公告)日：1997-11-20

申请号：DE19625493

申请日：1996-06-26

Applicant: IBM

Inventor： ELSNER GERHARD DR ,  GRESCHNER JOHANN DR ,  STOEHR ROLAND

IPC: G01R1/073 ,  G01R31/28 ,  H01L25/00

Abstract: The arrangement has a first stack (1) of hole plates in which the contact probes (1a-1d) are inserted with lateral flexibility. The probes are fixed onto or in a second contact plate stack (2). There is also a test card (3) and a pressure plate (4). The first and second hole plate stacks are connected and able to move wrt. each other. The test card is rigidly connected to a counter holder (5) and the pressure plate is movable wrt. the test card.

公开(公告)号：GB2306804A

公开(公告)日：1997-05-07

申请号：GB9621500

申请日：1996-10-16

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  MEISSNER KLAUS ,  STOEHR ROLAND ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

公开(公告)号：DE59309969D1

公开(公告)日：2000-04-13

申请号：DE59309969

申请日：1993-05-28

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER DR DIPL-PHYS ,  MEISSNER KLAUS ,  STOEHR ROLAND

IPC: H01L21/18 ,  H01L21/20 ,  H01L21/58 ,  H01L21/762 ,  G01R1/073 ,  H01L21/76

公开(公告)号：DE2830589A1

公开(公告)日：1980-01-31

申请号：DE2830589

申请日：1978-07-12

Applicant: IBM DEUTSCHLAND

Inventor： STOEHR ROLAND ,  OBMANN ROBERT

IPC: C30B31/10 ,  C30B31/16 ,  C30B33/00 ,  H01L21/20

Abstract: The furnace has a reaction tube wish several reaction zones behind each other, each with different gas atmos. The mixing of the reaction gases is prevented by partitions reaching down from the furnace top almost to the semiconductor chips. An exhaust system provides the gas circulation. The transport system for the chips (10) is formed by a row of longitudinal beams (7, 8) with loading and unloading devices. Some beams (8) are stationary and have their surface horizontal in a given plane. Other beams (7) are movable by a drive system (11, 14) in the direction of tube axis and orthogonally to the plane of the stationary beam surfaces. During each closed movement loop the moving beams are twice at the same height with the stationary ones in an alternating arrangement.

公开(公告)号：DE69426522T2

公开(公告)日：2001-05-31

申请号：DE69426522

申请日：1994-06-01

Applicant: IBM

Inventor： STOEHR ROLAND ,  KRATT RUDOLF

IPC: H01B11/00 ,  G01R1/067 ,  G01R1/073 ,  H01B11/18 ,  H01P3/06

公开(公告)号：DE19627442A1

公开(公告)日：1998-01-22

申请号：DE19627442

申请日：1996-07-08

Applicant: IBM

Inventor： DRUSCHKE FRANK DR ,  ELSNER GERHARD DR ,  GRESCHNER JOHANN DR ,  STOEHR ROLAND

IPC: G01R1/073 ,  F16B11/00 ,  G01R1/067

Abstract: The adhesive joints (1) are made at the surface (2), or within the guide holes (5) of a board, and are at an arbitrary angle in a stack of boards (3) made of silicon, to fit wires, glass fibres or micro-mechanical components permanently. The upper part, or upper layers, of the boards can have elongated holes (5a) to provide an adhesive reservoir, allowing a high viscosity, thixotropic adhesive to be used. The remainder of the holes (5b) are cylindrical, and of smaller size. Hundreds of closely spaced wire contacts, of 25 to 100 micron diameter, can be glued into the boards as test probes for the buckling beam tests.