公开(公告)号：CA1290074C

公开(公告)日：1991-10-01

申请号：CA600081

申请日：1989-05-18

Applicant: IBM

Inventor： FUNARI JOSEPH ,  GREEN MARY C ,  REYNOLDS SCOTT D ,  SAMMAKIA BAHGAT G

IPC: H01L23/34 ,  H01L23/367 ,  H01R12/57 ,  H01L23/40

Abstract: EN988027 An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g, polyimide having chrome-copper-chrome circuitry thereon) and a heat sink (e.g., extruded aluminum or copper). The heat sink includes pliant means (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.