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18 records (took 0.018 seconds)

    1.
    发明专利
    未知

    公开(公告)号：DE68920923T2

    公开(公告)日：1995-08-10

    申请号：DE68920923

    申请日：1989-05-12

    Applicant: IBM

    Inventor： FUNARI JOSEPH ,  GREEN MARY CERNY ,  REYNOLDS SCOTT DAVID ,  SAMMAKIA BAHGAT GHALEB

    IPC: H01L23/34 ,  H01L23/367 ,  H01R12/57

    Abstract: An electronic package (10) including a first substrate (11) (e.g., printed circuit board), a semiconductor device (13) (e.g., silicon chip), a second circuitized substrate (15) (e.g, polyimide having chrome-copper-chrome circuitry thereon) and a heat sink (41) (e.g., extruded aluminum or copper). The heat sink includes pliant means (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.

    3.
    发明专利
    未知

    公开(公告)号：DE69113187D1

    公开(公告)日：1995-10-26

    申请号：DE69113187

    申请日：1991-07-26

    Applicant: IBM

    Inventor： AMEEN JOSEPH G ,  FUNARI JOSEPH ,  GOLDFUSS JOHN A

    IPC: H01L21/60 ,  H01L23/538 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H01L23/498

    Abstract: A thin film electronic package which utilizes a circuitized substrate (e.g., a printed circuit board) having a flexible film carrier (11) electrically coupled thereto. The film carrier includes a dielectric layer (25) (e.g., polyimide) with first and second circuit layers (23, 27) located on opposite sides thereof. These circuit layers are interconnected, electrically, through the dielectric. An electronic device (13) (e.g., semiconductor chip) is electrically connected to bridging portions of the conductive leads of the carrier's first circuit layer, which bridging portions extend across apertures (29) provided within the dielectric. A plurality of solder elements (19) are utilized to provide electrical connection between respective contact locations of the electronic device and respective bridging portions of the first layer's conductive leads. Further a method of forming electrical connections between a flexible film carrier and an electronic device is described. The method comprises the steps of aligning the film carrier relative to the device having a plurality of solder mounds located on an upper surface thereof. The film carrier is engaged such that bridging portions of conductive leads thereof physically contact these solder mounds. Hot gas is passed through a screen member to heat the bridging portions of the leads to cause these leads to in turn heat the solder mounds to cause the mounds to become molten, whereafter these leads and mounds are cooled to form the desired solder bonds.

    5.
    发明专利
    未知

    公开(公告)号：DE1206281B

    公开(公告)日：1965-12-02

    申请号：DEJ0024207

    申请日：1963-08-07

    Applicant: IBM

    Inventor： FUNARI JOSEPH

    IPC: B23K1/08

    6.
    发明专利
    未知

    公开(公告)号：DE68920923D1

    公开(公告)日：1995-03-16

    申请号：DE68920923

    申请日：1989-05-12

    Applicant: IBM

    Inventor： FUNARI JOSEPH ,  GREEN MARY CERNY ,  REYNOLDS SCOTT DAVID ,  SAMMAKIA BAHGAT GHALEB

    IPC: H01L23/34 ,  H01L23/367 ,  H01R12/57

    Abstract: An electronic package (10) including a first substrate (11) (e.g., printed circuit board), a semiconductor device (13) (e.g., silicon chip), a second circuitized substrate (15) (e.g, polyimide having chrome-copper-chrome circuitry thereon) and a heat sink (41) (e.g., extruded aluminum or copper). The heat sink includes pliant means (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.

    9.
    发明专利
    未知

    公开(公告)号：DE69301060T2

    公开(公告)日：1996-07-04

    申请号：DE69301060

    申请日：1993-04-23

    Applicant: IBM

    Inventor： AMEEN JOSEPH GEORGE ,  FUNARI JOSEPH ,  MOORE RONALD JAMES

    IPC: B23K1/20 ,  H01L21/60 ,  B23K3/06 ,  H01L21/48 ,  H05K3/24 ,  H05K3/34

    Abstract: A method of precisely depositing accurately defined quantities of solder (21) onto high density circuit patterns (23) on a substrate (25) without use of a solder mask or the like wherein solder paste (21) is originally deposited within a precisely defined transfer member (11) (e.g., graphite block having holes drilled therein), the transfer member (15) then being aligned relative to the respective circuitry such that when both block (11) and substrate (25) are heated, solder flow and deposition will occur without the use of a solder mask or the like. Following deposition, a second circuit member (e.g., flexible circuit) may be electrically coupled to the substrate's conductors (23), the deposited solder providing the coupling medium. Hydrogen gas may be used during the heating of the paste and also during the soldering of the flexible circuit to the substrate.

    10.
    发明专利
    未知

    公开(公告)号：DE69301060D1

    公开(公告)日：1996-02-01

    申请号：DE69301060

    申请日：1993-04-23

    Applicant: IBM

    Inventor： AMEEN JOSEPH GEORGE ,  FUNARI JOSEPH ,  MOORE RONALD JAMES

    IPC: B23K1/20 ,  B23K3/06 ,  H01L21/60 ,  H01L21/48 ,  H05K3/24 ,  H05K3/34

    Abstract: A method of precisely depositing accurately defined quantities of solder (21) onto high density circuit patterns (23) on a substrate (25) without use of a solder mask or the like wherein solder paste (21) is originally deposited within a precisely defined transfer member (11) (e.g., graphite block having holes drilled therein), the transfer member (15) then being aligned relative to the respective circuitry such that when both block (11) and substrate (25) are heated, solder flow and deposition will occur without the use of a solder mask or the like. Following deposition, a second circuit member (e.g., flexible circuit) may be electrically coupled to the substrate's conductors (23), the deposited solder providing the coupling medium. Hydrogen gas may be used during the heating of the paste and also during the soldering of the flexible circuit to the substrate.

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