公开(公告)号：CA2045227A1

公开(公告)日：1992-03-10

申请号：CA2045227

申请日：1991-06-21

Applicant: IBM

Inventor： ANSCHEL MORRIS ,  BARBOSA JOSE A ,  DIBBLE ERIC P ,  FUNARI JOSEPH ,  KRESGE JOHN S ,  LAMB CHARLES R ,  MURPHY RICHARD G ,  REYNOLDS SCOTT D ,  SAMMAKIA BAHGAT G ,  SHOLTES TAMAR A ,  STORR WAYNE R JR

IPC: H01L23/36 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/18

Abstract: HIGH MEMORY DENSITY PACKAGE Disclosed is a high density microelectronic circuit package. The circuit package includes a plurality of IC chips, as memory chips, on a circuitized flexible tape, which is, in turn, bonded to a printed circuit board. The circuitized flexible tape extends outwardly from the printed circuit board and has a plurality of IC chips mounted on I/O pads on the tape. The individual IC chips are in thermal contact with a heat sink means on the surfaces thereof opposite the circuitized flexible tape. The circuitized flexible tape and the heat sink are bonded to a printed circuit board.

公开(公告)号：PL183696B1

公开(公告)日：2002-06-28

申请号：PL32281497

申请日：1997-10-24

Applicant: IBM

Inventor： KOSTEVA STEPHEN J ,  SAMMAKIA BAHGAT G

IPC: H01L23/40 ,  H05K7/20

公开(公告)号：CA1287929C

公开(公告)日：1991-08-20

申请号：CA601600

申请日：1989-06-02

Applicant: IBM

Inventor： ANSCHEL MORRIS ,  SAMMAKIA BAHGAT G

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/36

Abstract: An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrcme-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

公开(公告)号：CA2120557A1

公开(公告)日：1994-12-12

申请号：CA2120557

申请日：1994-04-05

Applicant: IBM

Inventor： ANSCHEL MORRIS ,  INGRAHAM ANTHONY P ,  LAMB CHARLES R ,  LOWELL MICHAEL D ,  MARKOVICH VOYA R ,  MAYR WOLFGANG ,  MURPHY RICHARD G ,  PIERSON MARK V ,  POWERS TAMAR A ,  RENY TIMOTHY S ,  REYNOLDS SCOTT D ,  SAMMAKIA BAHGAT G ,  STORR WAYNE R

IPC: G01R31/26 ,  G01R31/28 ,  H01L21/66 ,  H01R13/02

Abstract: METHOD AND APPARATUS FOR TESTING OF INTEGRATED CIRCUIT CHIPS A method of testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip test fixture system is provided. The chip test fixture system has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into electrically conductive contact with the conductor pads on the chip test fixture system. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing the chip is removed from the substrate.

公开(公告)号：MY118393A

公开(公告)日：2004-10-30

申请号：MYPI9502537

申请日：1995-08-25

Applicant: IBM

Inventor： MOK LAWRENCE S ,  PURUSHOTHAMAN SAMPATH ,  WILCZYNSKI JANUSZ S ,  SAMMAKIA BAHGAT G ,  WU TIEN Y

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/467

Abstract: AN ELECTRONIC PACKAGE HAVING AN ACTIVE COOLING SYSTEM FOR MAINTAINING A SEMICONDUCTOR CHIP(18) AT APPROXIMATELY A CONSTANT TEMPERATURE BY MONITORING THE PRESENT TEMPERATURE OF THE CHIP AND VARYING THE AIR FLOW OVER A HEAT SINK(13) IN THERMAL CONTACT WITH THE CHIP IN RESPONSE TO THE TEMPERATURE. IN ADDITION, THE TEMPERATURE DIFFERENCE BETWEEN THE SEMICONDUCTOR CHIP MODULE(12) AND A PRINTED CIRCUIT BOARD(11) IS ALSO MONITORED TO MAINTAIN THAT DIFFERENCE AT A PRESET VALUE. THE AIR FLOW IS VARIED BY A VARIABLE SPEED FAN(14,26) OR A VARIABLE DIRECTION BAFFLE. (FIG. 1)

公开(公告)号：SG32442A1

公开(公告)日：1996-08-13

申请号：SG1995001055

申请日：1995-08-04

Applicant: IBM

Inventor： MOK LAWRENCE S ,  PURUSHOTHAMAN SAMPATH ,  WILCZYNSKI JANUSZ S ,  SAMMAKIA BAHGAT G ,  WU TIEN Y

IPC: H01L23/34

公开(公告)号：CA1290074C

公开(公告)日：1991-10-01

申请号：CA600081

申请日：1989-05-18

Applicant: IBM

Inventor： FUNARI JOSEPH ,  GREEN MARY C ,  REYNOLDS SCOTT D ,  SAMMAKIA BAHGAT G

IPC: H01L23/34 ,  H01L23/367 ,  H01R12/57 ,  H01L23/40

Abstract: EN988027 An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g, polyimide having chrome-copper-chrome circuitry thereon) and a heat sink (e.g., extruded aluminum or copper). The heat sink includes pliant means (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.