公开(公告)号：US3586101A

公开(公告)日：1971-06-22

申请号：US3586101D

申请日：1969-12-22

Applicant: IBM

Inventor： CHU RICHARD C ,  GUPTA OMKARNATH R ,  HWANG UN-PAH ,  MORAN KEVIN P ,  SIMONS ROBERT E

IPC: F25B23/00 ,  H01L23/427 ,  F28D15/00

CPC classification number: H01L23/427 ,  F25B23/006 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plurality of electronic component modules to be cooled are located in each of a plurality of chambers through which a cooling liquid circulates by gravitational force from a buffer storage reservoir located at the top of said cooling system. Input connecting means are provided connecting each of the plurality of chambers to the above located buffer storage reservoir. A plurality of output conduits, all of the same length are provided, each connecting a respective one of said chambers to a phase-separation column. Nucleate boiling takes place at the hot components in the chambers and two-phase flow consisting of boiling vapor bubbles and cooling liquid passes through an output connection to a phase-separation column where the vapor bubbles rise and the liquid drops back into the circulation system. A condenser is located above the phase-separation column for condensing the rising vapor bubbles. Cooling means are located in the circulation means for returning the cooling liquid to a temperature below the boiling point.

公开(公告)号：FR2330148A1

公开(公告)日：1977-05-27

申请号：FR7628378

申请日：1976-09-14

Applicant: IBM

Inventor： CHU RICHARD C ,  GUPTA OMKARNATH R ,  HWANG UN-PAH ,  SIMONS ROBERT E

IPC: F25D9/00 ,  G12B15/02 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H01L23/44 ,  H01L23/473 ,  H05K7/20 ,  H01L23/46 ,  H01L27/00 ,  G12B15/00

Abstract: A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains elongated openings therein extending towards the heat generating components and on the same centers with respect thereto. A resilient member is located in the cap in communion with the inner end of the openings. A thermal conductive element is located in each of the openings forming a small peripheral gap between each opening wall and the associated thermal conductive element. The resilient member urges the thermal conductive elements into pressure contact with the heat generating components. A thermal conductive inert gas is located within the cap filling the peripheral gaps and the interfaces between the heat generating elements and the thermal conductive elements. The heat is removed from the cap by external heat removal means.