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    Cooling system having thermally induced circulation
    1.
    发明授权
    Cooling system having thermally induced circulation 失效
    具有热诱导循环的冷却系统

    公开(公告)号：US3609991A

    公开(公告)日：1971-10-05

    申请号：US3609991D

    申请日：1969-10-13

    Applicant: IBM

    Inventor： CHU RICHARD C ,  HWANG UN-PAH

    IPC: F25D9/00 ,  G12B15/02 ,  H01L23/427 ,  H05K7/20 ,  F25D17/00

    CPC classification number: F28D15/0266 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A PLURALITY OF MODULAR PACKAGED HEAT GENERATING ELECTRONIC COMPONENTS ARE COOLED SO AS TO REMAIN WITHIN PREDETERMINED OPERATING TEMPERATURE LIMITS. EACH OF THE MODULAR UNITS CONTAINS A CHAMBER HAVING A BOTTOM INLET AND TOP OUTLET. THE OUTLET AT THE TOP OF EACH MODULE IS CONNECTED TO AN INLET OF A RESERVOIR OF COOLING LIQUID ABOVE THE LIQUID LEVEL AND BELOW A CONDENSING UNIT. THE INLET OF EACH MODULAR UNIT IS CONNECTED TO THE RESERVOIR BELOW THE LIQUID LEVEL. A SUBCOOLER IS PROVIDED WITHIN THE LIQUID IN THE RESERVOIR FOR MAINTAINING THE COOLANT LIQUID BELOW A DESIRED TEMPERATURE. AS HEAT IS GENERATED AT THE COMPONENTS, NUCLEATE BOILING TAKES PLACE WHEREIN THE VAPOR BUBBLES RISE AND SET UP A TWO-PHASE FLOW WITHIN THE CONNECTION BETWEEN THE TOP OF THE MODULE AND THE RESERVOIR. THE VAPOR, UPON ENTERING THE RESERVOIR, RISES AND CONDENSES ON THE CONDENSER WHILE THE FLUID FALLS INTO THE LIQUID WITHIN THE CONTAINER. THIS TWO-PHASE FLOW SETS UP A PUMPING ACTION WHICH INDUCES THE NATURAL CIRCULATION WITHIN THE SYSTEM. THE SYSEM IS SELF-REGULATING IN THAT AS THE HEAT GENERATION INCREASES, THE NUCLEATE BOILING INCREASES, THUS INCREASING THE PUMPING ACTION TO THEREBY INCREASE THE COOLING.

    Cooling system for data processing equipment
    3.
    发明授权
    Cooling system for data processing equipment 失效
    数据处理设备冷却系统

    公开(公告)号：US3586101A

    公开(公告)日：1971-06-22

    申请号：US3586101D

    申请日：1969-12-22

    Applicant: IBM

    Inventor： CHU RICHARD C ,  GUPTA OMKARNATH R ,  HWANG UN-PAH ,  MORAN KEVIN P ,  SIMONS ROBERT E

    IPC: F25B23/00 ,  H01L23/427 ,  F28D15/00

    CPC classification number: H01L23/427 ,  F25B23/006 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A plurality of electronic component modules to be cooled are located in each of a plurality of chambers through which a cooling liquid circulates by gravitational force from a buffer storage reservoir located at the top of said cooling system. Input connecting means are provided connecting each of the plurality of chambers to the above located buffer storage reservoir. A plurality of output conduits, all of the same length are provided, each connecting a respective one of said chambers to a phase-separation column. Nucleate boiling takes place at the hot components in the chambers and two-phase flow consisting of boiling vapor bubbles and cooling liquid passes through an output connection to a phase-separation column where the vapor bubbles rise and the liquid drops back into the circulation system. A condenser is located above the phase-separation column for condensing the rising vapor bubbles. Cooling means are located in the circulation means for returning the cooling liquid to a temperature below the boiling point.

    LOCAL HUMIDITY ADJUSTMENT SYSTEM, ELECTRONIC DEVICE ASSEMBLY AND ITS MANUFACTURE
    9.
    发明专利
    LOCAL HUMIDITY ADJUSTMENT SYSTEM, ELECTRONIC DEVICE ASSEMBLY AND ITS MANUFACTURE 失效

    公开(公告)号：JP2001024127A

    公开(公告)日：2001-01-26

    申请号：JP2000192392

    申请日：2000-06-27

    Applicant: IBM

    Inventor： CHU RICHARD C ,  ELLSWORTH JR MICHAEL J ,  ROBERT E SIMONS

    IPC: H01L23/473 ,  H05K1/02 ,  H05K5/02 ,  H05K7/20

    Abstract: PROBLEM TO BE SOLVED: To provide a humidity adjustment system and a humidity adjustment method of a low temperature electronic device assembly which keep the surface of the low temperature electronic device assembly at a temperature higher than the environmental dew point. SOLUTION: A humidity adjustment system includes a 1st heat insulating layer 5 which surrounds and is brought into contact with a cooled electronic device at least partially, and 2nd heat insulating layers 3 and 19 which surrounds the 1st heat insulating layer 5 and the cooled electronic device to define the internal space between the 1st heat insulating layer 5 and the 2nd heat insulating layers 3 and 19. A heater assembly functions as an interface between the electronic device and the internal space, and heats the internal space to a temperature high enough to keep the surface of the cooled electronic device at a temperature higher than the environmental dew point. The heater assembly includes thin film heaters 6 attached to the 1st heat insulating layer 5 in order to keep the surface at a temperature higher than the environmental dew point, and wire mesh heaters 7 hung in the internal space in order to lower a relative humidity in the internal space and avoid the penetration of steam.

    METHOD AND APPARATUS FOR COMBINED AIR AND LIQUID COOLING OF STACKED ELECTRONIC MODULES
    10.
    发明专利
    METHOD AND APPARATUS FOR COMBINED AIR AND LIQUID COOLING OF STACKED ELECTRONIC MODULES 未知

    公开(公告)号：AU2003302342A1

    公开(公告)日：2004-06-18

    申请号：AU2003302342

    申请日：2003-10-10

    Applicant: IBM

    Inventor： FUREY EDWARD ,  SCHMIDT ROGER R ,  SIMONS ROBERT E ,  CHU RICHARD C ,  ELLSWORTH MICHAEL J JR

    IPC: H05K7/20

    Abstract: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow. The enclosure also may be provided with automatically opening vent panels to allow room air to circulate and cool in the event of an over-temperature condition. The design of the enclosure permits it to be constructed apart from the rack-mounted apparatus and subsequently attached to the rack, if desired, at the facility at which the rack had been previously operating.

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