公开(公告)号：US3010052A

公开(公告)日：1961-11-21

申请号：US78435458

申请日：1958-12-31

Applicant: IBM

Inventor： HEATH ROBERT E ,  YOUNG WALTER M

IPC: H05K7/02

CPC classification number: H05K7/02

公开(公告)号：FR2387529A1

公开(公告)日：1978-11-10

申请号：FR7805791

申请日：1978-02-23

Applicant: IBM

Inventor： BABUKA ROBERT ,  HEATH ROBERT E ,  SAXENMEYER GEORGE J JR ,  SCHULTZ LEWIS K

IPC: H01H1/06 ,  C25D5/16 ,  H01H1/14 ,  H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H01R13/28 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R3/00 ,  C25D3/00 ,  H05K1/04

Abstract: An improved electrical contact device, comprising a conductor member; and a bundle of minute metal protrusions formed on the conductive member by a dendritic growth of conducting metal crystals. (Machine-translation by Google Translate, not legally binding)

公开(公告)号：CA1121011A

公开(公告)日：1982-03-30

申请号：CA301230

申请日：1978-04-17

Applicant: IBM

Inventor： BABUKA ROBERT ,  HEATH ROBERT E ,  SAXENMEYER GEORGE J JR ,  SCHULTZ LEWIS K

IPC: C25D5/16 ,  H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H01R13/28 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R9/09 ,  H05K1/02

Abstract: DENDRITIC ELECTRICAL CONTACTS AND CONNECTORS An electrical contact is provided by forming on a contact pad or contact surface a bunch of tiny resilient metal projections by a dendritic growth thereon of conductive metal crystals. A separable or disconnectable electrical connection is provided by urging the dendritic projections on mating contacts into intermeshing or interwedging engagement. Good quality submillimeter size electrical contacts are readily fabricated and are particularly useful for providing low cost spaceefficient multipoint connector systems for large-scale integration (LSI) circuit modules, printed circuit cards and boards and other modern day electronics hardware.