公开(公告)号：US3398580A

公开(公告)日：1968-08-27

申请号：US50176165

申请日：1965-10-22

Applicant: IBM

Inventor： NYMAN GEORGE E ,  SCHULTZ LEWIS K

IPC: G01K1/14

CPC classification number: G01K1/14

公开(公告)号：US3892646A

公开(公告)日：1975-07-01

申请号：US6442470

申请日：1970-08-17

Applicant: IBM

Inventor： LAZZARINI DONALD J ,  SCHULTZ LEWIS K

IPC: C09D5/44 ,  C25D13/06 ,  C25D13/12

CPC classification number: C09D5/4426

Abstract: Selected electrical connector contacts on a flexible support, which are to be mated to corresponding contacts on a rigid circuit board, are electrophoretically coated with a blend of a polyethylene ionomer emulsion and an epoxy ester polymer emulsion by selectively isolating from the electrophoretic deposition current those contacts which are not to be coated. An electrophoretic coating bath useful therefor comprises an aqueous blend of the above polymers and yields a very thin electrophoretic coating which is a blend of the above polymers and which exhibits both high insulation values and excellent mechanical resistance to cracking and compression when mated to rigid surfaces at pressure loads of over 50 psi. An electrical connector assembly comprises a flexible backing with a number of lengthy, narrowly spaced electrical contacts thereon. Alternate contacts are coated with a thin electrophoretically deposited coating, as described above, less then 0.00071 inch thick. The coating comprises 60-40 parts polyethylene ionomer and 40-60 parts epoxy ester polymer. When the electrical connector is mated, under pressure, to a corresponding electrical connector assembly, shorting is prevented. The mated connector assembly is also claimed.

Abstract translation: 通过选择性地与电泳沉积电流隔离，电连接器接触在柔性支撑件上，该柔性支撑件将与刚性电路板上的相应触点相配合，通过选择性地与电泳沉积电流隔离来电泳涂覆聚乙烯离聚物乳液和环氧酯聚合物乳液的共混物 其不被涂覆。

公开(公告)号：FR2387529A1

公开(公告)日：1978-11-10

申请号：FR7805791

申请日：1978-02-23

Applicant: IBM

Inventor： BABUKA ROBERT ,  HEATH ROBERT E ,  SAXENMEYER GEORGE J JR ,  SCHULTZ LEWIS K

IPC: H01H1/06 ,  C25D5/16 ,  H01H1/14 ,  H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H01R13/28 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R3/00 ,  C25D3/00 ,  H05K1/04

Abstract: An improved electrical contact device, comprising a conductor member; and a bundle of minute metal protrusions formed on the conductive member by a dendritic growth of conducting metal crystals. (Machine-translation by Google Translate, not legally binding)

公开(公告)号：CA1121011A

公开(公告)日：1982-03-30

申请号：CA301230

申请日：1978-04-17

Applicant: IBM

Inventor： BABUKA ROBERT ,  HEATH ROBERT E ,  SAXENMEYER GEORGE J JR ,  SCHULTZ LEWIS K

IPC: C25D5/16 ,  H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H01R13/28 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R9/09 ,  H05K1/02

Abstract: DENDRITIC ELECTRICAL CONTACTS AND CONNECTORS An electrical contact is provided by forming on a contact pad or contact surface a bunch of tiny resilient metal projections by a dendritic growth thereon of conductive metal crystals. A separable or disconnectable electrical connection is provided by urging the dendritic projections on mating contacts into intermeshing or interwedging engagement. Good quality submillimeter size electrical contacts are readily fabricated and are particularly useful for providing low cost spaceefficient multipoint connector systems for large-scale integration (LSI) circuit modules, printed circuit cards and boards and other modern day electronics hardware.

公开(公告)号：CA943677A

公开(公告)日：1974-03-12

申请号：CA118593

申请日：1971-07-20

Applicant: IBM

Inventor： LAZZARINI DONALD J ,  SCHULTZ LEWIS K

IPC: C09D5/44