公开(公告)号：FR2387529A1

公开(公告)日：1978-11-10

申请号：FR7805791

申请日：1978-02-23

Applicant: IBM

Inventor： BABUKA ROBERT ,  HEATH ROBERT E ,  SAXENMEYER GEORGE J JR ,  SCHULTZ LEWIS K

IPC: H01H1/06 ,  C25D5/16 ,  H01H1/14 ,  H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H01R13/28 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R3/00 ,  C25D3/00 ,  H05K1/04

Abstract: An improved electrical contact device, comprising a conductor member; and a bundle of minute metal protrusions formed on the conductive member by a dendritic growth of conducting metal crystals. (Machine-translation by Google Translate, not legally binding)

公开(公告)号：CA2110472A1

公开(公告)日：1994-09-02

申请号：CA2110472

申请日：1993-12-01

Applicant: IBM

Inventor： BHATT ANILKUMAR C ,  BUDA LEO R ,  EDWARDS ROBERT D ,  HART PAUL J ,  INGRAHAM ANTHONY P ,  MARKOVICH VOYA R ,  MOLLA JAYNAL A ,  MURPHY RICHARD G ,  SAXENMEYER GEORGE J JR ,  WALKER GEORGE F ,  WHALEN BETTE J ,  ZARR RICHARD S

IPC: G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  G01R31/26

Abstract: A method of testing semiconductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip carrier is provided. The chip carrier has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into conductive contact with the conductor pads on the chip carrier. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing, the chip may be removed from the substrate. Alternatively, the chip may be bonded through the dendritic conductor pads to the substrate after successful testing.

公开(公告)号：CA1121011A

公开(公告)日：1982-03-30

申请号：CA301230

申请日：1978-04-17

Applicant: IBM

Inventor： BABUKA ROBERT ,  HEATH ROBERT E ,  SAXENMEYER GEORGE J JR ,  SCHULTZ LEWIS K

IPC: C25D5/16 ,  H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H01R13/28 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R9/09 ,  H05K1/02

Abstract: DENDRITIC ELECTRICAL CONTACTS AND CONNECTORS An electrical contact is provided by forming on a contact pad or contact surface a bunch of tiny resilient metal projections by a dendritic growth thereon of conductive metal crystals. A separable or disconnectable electrical connection is provided by urging the dendritic projections on mating contacts into intermeshing or interwedging engagement. Good quality submillimeter size electrical contacts are readily fabricated and are particularly useful for providing low cost spaceefficient multipoint connector systems for large-scale integration (LSI) circuit modules, printed circuit cards and boards and other modern day electronics hardware.