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    Semiconductor device assembly having a stress-relieving buffer layer
    1.
    发明公开
    Semiconductor device assembly having a stress-relieving buffer layer 无效
    具有应力缓冲缓冲层的半导体器件组件

    公开(公告)号：KR20100138742A

    公开(公告)日：2010-12-31

    申请号：KR20100046967

    申请日：2010-05-19

    Applicant: IBM

    Inventor： JADHAV VIRENDRA R ,  SIKKA KAMAL KUMAR ,  ZHENG JIANTAO

    IPC: H01L23/373 ,  H01L23/367

    CPC classification number: H01L23/3735 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83951

    Abstract: PURPOSE: A semiconductor device assembly having a stress-relieving buffer layer is provided to prevent the slitting phenomenon of the heat transfer material by removing the increasing factors of concentration force between a buffer layer and a heat discharge apparatus. CONSTITUTION: A semiconductor device(114) is mounted on a chip carrier substrate(112). The semiconductor device is electrically connected with a solder ball(116) to the substrate. An underfill material(118) is formed on the lower part of the semiconductor device. A heat radiator(120) comprises a leg(122) fixed with the adhesive to the substrate.

    Abstract translation: 目的：提供一种具有应力消除缓冲层的半导体器件组件，通过消除缓冲层和放热装置之间的浓度增加因素来防止传热材料的切割现象。 构成：半导体器件（114）安装在芯片载体衬底（112）上。 半导体器件与焊料球（116）电连接到衬底。 在半导体器件的下部形成有底部填充材料（118）。 散热器（120）包括用粘合剂固定到基底上的腿部（122）。

    Stiffener ring for reducing stress
    3.
    发明专利
    Stiffener ring for reducing stress 有权
    用于减轻应力的强化环

    公开(公告)号：JP2006270108A

    公开(公告)日：2006-10-05

    申请号：JP2006101006

    申请日：2006-03-31

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： ALCOE DAVID J ,  BLACKWELL KIM J ,  JADHAV VIRENDRA R

    IPC: B42D15/10 ,  H01L23/12 ,  G06K19/077 ,  H01L23/00 ,  H01L23/10 ,  H01L23/16 ,  H01L23/31 ,  H01L23/36

    CPC classification number: H01L23/562 ,  H01L23/10 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/36 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/0401

    Abstract: PROBLEM TO BE SOLVED: To provide a stiffener for reducing stress, in particular, generated in a material in a laminate coupled to a circuit card by bending the circuit card, as to electronic structure and a forming method related thereto. SOLUTION: The laminate 20 is coupled to an electron carrier 30 by soldering. The stiffener 15 is attached to one portion of a surface in the laminate 20 with a stiffener adhesive 16 using an adhesive, and the stiffener adhesive 16 contacts physically with one portion of the first surface 11 of the stiffener 15, and the portion of the surface in the laminate 20 with the adhesive. A thermal lid 28 is attached to one portion of the second surface 32 in the stiffener 15 with a lid adhesive 27 using the adhesive, and the lid adhesive 27 contacts physically with one portion of a surface 35 in the lid and one portion of the second surface 32 of the stiffener 20 with the adhesive. A void area is arranged between the surface 35 in the thermal lid 28 and the surface in the laminate 20. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种用于减小应力的加强件，特别是通过弯曲电路卡而与电路卡连接的层压材料中产生的电子结构和与其相关的成形方法。 解决方案：层压体20通过焊接与电子载体30耦合。 加强件15使用粘合剂与加强件粘合剂16连接在层压体20中的表面的一部分上，并且加强件粘合剂16物理地与加强件15的第一表面11的一部分接触，并且表面的部分 在具有粘合剂的层压体20中。 热盖28通过使用粘合剂的盖粘合剂27附接在加强件15中的第二表面32的一部分上，并且盖粘合剂27物理地与盖中的表面35的一部分接触，并且第二部分的一部分 具有粘合剂的加强件20的表面32。 在热盖28中的表面35和层压体20中的表面之间布置有空隙区域。（C）2007年，JPO和INPIT

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