公开(公告)号：SG93853A1

公开(公告)日：2003-01-21

申请号：SG1999006302

申请日：1999-12-09

Applicant: IBM

Inventor： VINCENT J MCGAHAY ,  THOMAS H IVERS ,  HENRY A NYE III ,  JOYCE C LUI

IPC: H01L21/3205 ,  H01L21/28 ,  H01L21/768 ,  H01L23/52 ,  H01L23/532

Abstract: Poorly adherent layers such as silicon nitride and silicon dioxide exhibit improved adhesion to copper member by providing an intervening germanium-containing layer. The germanium-containing layer is copper germanide, germanium oxide, germanium nitride or combinations thereof. The germanium-containing layer enhances the adhesion such that the poorly adherent layer is less susceptible to delamination from the copper member.