公开(公告)号：JP2005087996A

公开(公告)日：2005-04-07

申请号：JP2004237592

申请日：2004-08-17

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： WEISS THOMAS ,  HUMENIK JAMES N ,  LAPLANTE MARK J ,  LONG DAVID C

IPC: B05D3/00 ,  B05C5/00 ,  B05C11/10 ,  B05D5/12 ,  B67D7/60 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12

CPC classification number: B05C11/1034 ,  H05K1/092 ,  H05K3/1241 ,  H05K2203/0126

Abstract: PROBLEM TO BE SOLVED: To provide an improved method and apparatus for distributing conductive pastes of various fluidizing materials on a workpiece such as a ceramic green sheet or the like.
SOLUTION: This is a method for distributing a fluid conductive paste on a green sheet 30 from a distribution device 46 which is provided with an orifice member 56 having a hole 64, a pressure chamber 48 storing a paste, adjacent to the orifice member, and a punch 60 having a movable surface through the hole of the orifice member. This method is comprised of a step of arranging a punch outside the hole of the orifice member so that the punch surface is spaced apart from the orifice member, a step of flowing a desired paste quantity to the punch surface, a step of transferring the paste on the punch surface through the hole of the orifice member until the punch surface extends over the orifice member, and a step of attaching the paste on the green sheet by contacting the paste which is still remaining on the punch surface with the workpiece.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种用于在诸如陶瓷生片等工件上分配各种流化材料的导电浆料的改进方法和装置。 解决方案：这是一种从生片30上分配流体导电膏的方法，该分配装置46设置有具有孔64的孔口构件56，存储有与浆料邻接的孔的压力室48 以及具有穿过孔口构件的孔的可移动表面的冲头60。 该方法包括以下步骤：在孔口部件的孔的外部设置冲头，使得冲头表面与孔部件间隔开，将期望的浆料量流向冲头表面的步骤，将浆料 在冲头表面上穿过孔口构件的孔，直到冲头表面延伸到孔口构件上方，以及通过使仍然保留在冲头表面上的浆料与工件接触来将糊料附着在生坯板上的步骤。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004241771A

公开(公告)日：2004-08-26

申请号：JP2004020523

申请日：2004-01-28

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： CASEY JON A ,  BALZ JAMES G ,  BERGER MICHAEL ,  COHEN JEROME ,  HENDRICKS CHARLES ,  INDYK RICHARD ,  LAPLANTE MARK ,  LONG DAVID C ,  MAIORINO LORI A ,  MERRYMAN ARTHUR G ,  POMERANTZ GLENN A ,  RITA ROBERT A ,  SEMKOW KRYSTYNA W ,  SPENCER PATRICK E ,  SUNDLOF BRIAN R ,  SURPRENANT RICHARD P ,  WALL DONALD R ,  WASSICK THOMAS A ,  WILEY KATHLEEN M

IPC: H05K3/46 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/22

CPC classification number: H05K3/225 ,  H01L21/4846 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/4629 ,  H05K2203/173 ,  Y10T29/49124 ,  Y10T29/49135 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer ceramic correction process which forms a new electric correction path for connecting top vias. SOLUTION: A correction path 65 is provided between a defect net 40 and a redundancy correction net 45 in a multilayer ceramic substrate. The defect net and the correction net are terminated at top vias 41 and 46 of the substrate. The defect net is electrically isolated from an electric correction structure by the use of laser, and a post-burning circuit is formed on and in the substrate. In addition, the passivation of an electric correction line 65 is performed. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：CA2006229A1

公开(公告)日：1990-09-14

申请号：CA2006229

申请日：1989-12-20

Applicant: IBM

Inventor： BECKHAM KEITH F ,  CHALLENER DAVID C ,  GUPTA ARUNAVA ,  HARVILCHUCK JOSEPH M ,  LEAS JAMES M ,  LLOYD JAMES R ,  LONG DAVID C ,  QUINONES HORATIO ,  SESHAN KRISHNA ,  SHATZKES MORRIS

IPC: B23K26/00 ,  H01L21/3205 ,  H01L21/82 ,  H01L23/52 ,  H01L23/525 ,  H05K3/22 ,  G01R31/26

Abstract: METHOD AND APPARATUS FOR CAUSING AN OPEN CIRCUIT IN A CONDUCTIVE LINE A method for causing an open circuit in an electrical conductor is provided, including the steps of: conducting a direct current through the conductor; and applying heat at a selected location on the conductor whereat it is desired to cause the open circuit of the conductor. . FI9-88-027

公开(公告)号：CA2077062A1

公开(公告)日：1994-02-28

申请号：CA2077062

申请日：1992-08-27

Applicant: IBM

Inventor： LONG DAVID C ,  BENDER HOWARD A ,  CARBAUGH WILLIAM D JR ,  LA PLANTE MARK J ,  SETZER CHRISTOPHER D

IPC: H01S3/04 ,  H01S3/042 ,  H01S3/06 ,  H01S3/093 ,  H01S3/0941 ,  H01S3/11 ,  H01S3/091

Abstract: METHOD AND APPARATUS FOR AN INCREASED PULSE REPETITION RATE FOR A CW PUMPED LASER A solid state lasing rod is spun on its long axis. The rod is pumped with photons while it spins. The rod is greater in diameter than the aperture. The rod is aligned off-center from the center of the aperture so that different portions of the rod are exposed to the aperture for lasing. The repetition rate of the lasing of the laser is increased because as the rod spins, the area of the rod that is not lasing is being charged. The laser rod can also be hollow to allow for pumping of the photons from either outside or inside the hollow bore or both. Similarly, this hollow bore in the laser rod could also allow cooling fluids to be circulated therethrough.