公开(公告)号：DE2965795D1

公开(公告)日：1983-08-04

申请号：DE2965795

申请日：1979-08-23

Applicant: IBM

Inventor： BALDERES DEMETRIOS ,  LYNCH JOHN RICHARD ,  YACAVONIS ROBERT ANTHONY

IPC: H05K7/20 ,  H01L23/04 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H01L23/473 ,  H01L23/36

Abstract: A semiconductor device package having a substrate, one or more semiconductor devices mounted on the top surface of the substrate, a heat sink having a surface in opposed spaced parallel relation to the top surface of the substrate, and at least one deformable heat transfer member positioned between a device mounted on the top surface of the substrate, and the surface of the heat sink. The heat transfer member is comprised of a porous block of material, and a heat conductive non-volatile liquid retained within the block of material by a surface tension. The heat transfer member being operative to transfer heat from the device to the heat sink.