公开(公告)号：DE3475142D1

公开(公告)日：1988-12-15

申请号：DE3475142

申请日：1984-05-23

Applicant: IBM

Inventor： HULTMARK ERIC BRUCE ,  METREAUD CLAUDE GEORGES ,  YACAVONIS ROBERT ANTHONY

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/40

Abstract: A heat sink structure for mounting on a semiconductor package includes a plurality of pins (20) affixed to a lid on the package (12-16), and a cooling fin means (26) having a thin walled, cellular configuration with the cells defining parallel elongated openings that extend through the fin means. The pins (20) are seated in the cells of the fin means.

公开(公告)号：DE2965795D1

公开(公告)日：1983-08-04

申请号：DE2965795

申请日：1979-08-23

Applicant: IBM

Inventor： BALDERES DEMETRIOS ,  LYNCH JOHN RICHARD ,  YACAVONIS ROBERT ANTHONY

IPC: H05K7/20 ,  H01L23/04 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H01L23/473 ,  H01L23/36

Abstract: A semiconductor device package having a substrate, one or more semiconductor devices mounted on the top surface of the substrate, a heat sink having a surface in opposed spaced parallel relation to the top surface of the substrate, and at least one deformable heat transfer member positioned between a device mounted on the top surface of the substrate, and the surface of the heat sink. The heat transfer member is comprised of a porous block of material, and a heat conductive non-volatile liquid retained within the block of material by a surface tension. The heat transfer member being operative to transfer heat from the device to the heat sink.