公开(公告)号：DE3469631D1

公开(公告)日：1988-04-07

申请号：DE3469631

申请日：1984-12-27

Applicant: IBM

Inventor： LINDE HAROLD GEORGE ,  MACINTYRE MICHAEL WILFORD ,  MOTSIFF WILLIAM THOMAS

IPC: C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/312 ,  H01L23/29 ,  H01L23/31

Abstract: A polyamic acid copolymer forming a polyimide comprising, in mole percent, from 5 to 45 percent pyromellitic dianhydride, from 5 to 45 percent oxydiphthalic dianhydride, and about 50 percent of oxydianiline is disclosed. Polyimides formed by curing the copolymer are also disclosed as is a process for forming a heat sealable coating on or dielectric isolation layer within electronic circuitry using the copolymer.