公开(公告)号：HK1006241A1

公开(公告)日：1999-02-19

申请号：HK98105469

申请日：1998-06-17

Applicant: IBM

Inventor： BROUILLETTE GUY PAUL ,  DANOVITCH DAVID HIRSCH ,  LIEHR MICHAEL ,  MOTSIFF WILLIAM THOMAS ,  ROLDAN JUDITH MARIE ,  SAMBUCETTI CARLOS JUAN

IPC: H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34 ,  H01L

Abstract: An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.

公开(公告)号：DE3469631D1

公开(公告)日：1988-04-07

申请号：DE3469631

申请日：1984-12-27

Applicant: IBM

Inventor： LINDE HAROLD GEORGE ,  MACINTYRE MICHAEL WILFORD ,  MOTSIFF WILLIAM THOMAS

IPC: C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/312 ,  H01L23/29 ,  H01L23/31

Abstract: A polyamic acid copolymer forming a polyimide comprising, in mole percent, from 5 to 45 percent pyromellitic dianhydride, from 5 to 45 percent oxydiphthalic dianhydride, and about 50 percent of oxydianiline is disclosed. Polyimides formed by curing the copolymer are also disclosed as is a process for forming a heat sealable coating on or dielectric isolation layer within electronic circuitry using the copolymer.

公开(公告)号：MY125463A

公开(公告)日：2006-08-30

申请号：MYPI9703540

申请日：1997-08-04

Applicant: IBM

Inventor： BROUILLETTE GUY PAUL ,  DANOVITCH DAVID HIRSCH ,  LIEHR MICHAEL ,  MOTSIFF WILLIAM THOMAS ,  ROLDAN JUDITH MARIE ,  SAMBUCETTI CARLOS JUAN ,  SARAF RAVI F

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34

Abstract: AN INTERCONNECT SYSTEM THAT HAS LOW ALPHA PARTICLE EMISSION CHARACTERISTICS FOR USE IN AN ELECTRONIC DEVICE INCLUDES A SEMICONDUCTOR CHIP (12) THAT HAS AN UPPER SURFACE AND SPACED APART ELECTRICALLY RESISTIVE BUMPS (26,36) POSITIONED ON CONDUCTIVE REGIONS OF THE UPPER SURFACE, THE ELECTRICALLY RESISTIVE BUMPS ARE MADE OF A COMPOSITE MATERIAL OF A POLYMER AND METAL PARTICLES, AND A SUBSTRATE (10) THAT HAS CONDUCTIVE REGIONS BONDED TO THE ELECTRICALLY RESISTIVE BUMPS IN A BONDING PROCESS WHEREIN THE ELECTRICALLY RESISTIVE BUMPS CONVERT TO ELECTRICALLY CONDUCTIVE BUMPS AFTER THE BONDING PROCESS.(FIG.3)

公开(公告)号：SG72751A1

公开(公告)日：2000-05-23

申请号：SG1997002768

申请日：1997-08-02

Applicant: IBM

Inventor： BROUILLETTE GUY PAUL ,  DANOVITCH DAVID HIRSCH ,  LIEHR MICHAEL ,  MOTSIFF WILLIAM THOMAS ,  ROLDAN JUDITH MARIE ,  SAMBUCETTI CARLOS JUAN ,  SARAF RAVI F

IPC: H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34 ,  H01L21/44 ,  H01L21/98

Abstract: An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.