公开(公告)号：US3586101A

公开(公告)日：1971-06-22

申请号：US3586101D

申请日：1969-12-22

Applicant: IBM

Inventor： CHU RICHARD C ,  GUPTA OMKARNATH R ,  HWANG UN-PAH ,  MORAN KEVIN P ,  SIMONS ROBERT E

IPC: F25B23/00 ,  H01L23/427 ,  F28D15/00

CPC classification number: H01L23/427 ,  F25B23/006 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plurality of electronic component modules to be cooled are located in each of a plurality of chambers through which a cooling liquid circulates by gravitational force from a buffer storage reservoir located at the top of said cooling system. Input connecting means are provided connecting each of the plurality of chambers to the above located buffer storage reservoir. A plurality of output conduits, all of the same length are provided, each connecting a respective one of said chambers to a phase-separation column. Nucleate boiling takes place at the hot components in the chambers and two-phase flow consisting of boiling vapor bubbles and cooling liquid passes through an output connection to a phase-separation column where the vapor bubbles rise and the liquid drops back into the circulation system. A condenser is located above the phase-separation column for condensing the rising vapor bubbles. Cooling means are located in the circulation means for returning the cooling liquid to a temperature below the boiling point.