公开(公告)号：DE69433769D1

公开(公告)日：2004-06-17

申请号：DE69433769

申请日：1994-03-04

Applicant: IBM

Inventor： O'CONNOR LORETTA JEAN ,  PREVITI-KELLY ROSEMARY ANN ,  REEN THOMAS JOSEPH

IPC: H01L21/28 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46

公开(公告)号：MY114888A

公开(公告)日：2003-02-28

申请号：MYPI9501897

申请日：1995-07-06

Applicant: IBM

Inventor： COCKERILL MARTHA ASHLEY CLARK ,  MALTABES JOHN GEORGE ,  O'CONNOR LORETTA JEAN ,  VOLDMAN STEVEN HOWARD

IPC: H01L25/00 ,  H01L27/00 ,  H01L21/66 ,  H01L21/98 ,  H01L25/065

Abstract: A FABRICATION METHOD FOR MANUFACTURING A MONOLITHIC ELECTRONIC MODULE(31) COMPRISING A PLURALITY OF STACKED PLANAR EXTENDING ARRAYS (23) OF INTEGRATED CIRCUIT CHIPS (13,17). THE FABRICATION METHOD INCLUDES DICING A WAFER OF INTEGRATED CIRCUIT CHIPS INTO A PLURALITY OF ARRAYS OF INTEGRATED CIRCUIT CHIPS. THE ARRAYS OF INTEGRATED CIRCUIT CHIPS ARE THEN STACKED TO FORM AN ELECTRONIC MODULE. A METALLIZATION PATTERN (33) MAY BE DEPOSITED ON A SUBSTANTIALLY PLANAR SURFACE OF THE ELECTRONIC MODULE, AND USED TO INTERCONNECT THE VARIOUS ARRAYS OF INTEGRATED CIRCUIT CHIPS CONTAINED THEREIN. SPECIFIC DETAILS OF THE FABRICATION METHOD AND RESULTANT MULTI-CHIP PACKAGE ARE SET FORTH.