公开(公告)号：JPH08293554A

公开(公告)日：1996-11-05

申请号：JP9653496

申请日：1996-04-18

Applicant: IBM

Inventor： LEIDY ROBERT K ,  MILLER JEFFREY S ,  PATRICK JON A ,  PREVITI-KELLY ROSEMARY ANN

IPC: H01L21/3205 ,  H01L21/304 ,  H01L21/768 ,  H01L23/485 ,  H01L23/522 ,  H01L23/532

Abstract: PROBLEM TO BE SOLVED: To reduce a short circuit by forming a first via where a part of a substrate is exposed from the upper face of a polymer film through the film and a first insulating layer, a removing only a second insulating layer covering a metal interconnection stud end and forming a second via from the second insulating layer to the stud end. SOLUTION: The first via 60 which vertically extends from the upper surface 45 of the polymer film through the polymer film 40 and the first insulating layer 30 and exposes a part of the semiconductor substrate 20 is formed. Conductive metal is deposited to the first via 60 and it is planarized A metal interconnection stud 65 having the end making a plane with the upper surface 45 of the polymer film is formed. Then, the part of the second insulating layer 50 which directly covers the end 70 of the stud 65 is removed and the second via 80 extending to the stud end 70 through the second insulating layer 50 is formed. Thus, the short circuit of a metallization layer in the semiconductor device can be reduced.

公开(公告)号：JPS61252648A

公开(公告)日：1986-11-10

申请号：JP1598586

申请日：1986-01-29

Applicant: IBM

Inventor： CLODGO DONNA JEAN ,  PREVITI-KELLY ROSEMARY ANN ,  WALTON ERICK GREGORY

IPC: H01L21/3205 ,  H01L21/027 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/768 ,  H05K3/14

公开(公告)号：DE69114759T2

公开(公告)日：1996-06-20

申请号：DE69114759

申请日：1991-04-13

Applicant: IBM

Inventor： CRONIN JOHN EDWARD ,  KAANTA CARTER WELLING ,  PREVITI-KELLY ROSEMARY ANN ,  RYAN JAMES GARDNER

IPC: C08L79/08 ,  H01L21/312 ,  H01L21/768 ,  H01L23/528 ,  H01L23/485

公开(公告)号：DE3683461D1

公开(公告)日：1992-02-27

申请号：DE3683461

申请日：1986-10-07

Applicant: IBM

Inventor： CLODGO DONNA JEAN ,  PREVITI-KELLY ROSEMARY ANN ,  WALTON ERICK GREGORY

IPC: B32B27/00 ,  C08G77/38 ,  C08J5/18 ,  C09D183/04 ,  H01L21/312

Abstract: By hydrolyzing an organoalkoysilane monomer at high concentration in solution to form a silanol, allowing the silanol to age to produce a low molecular weight oligomer, spin-applying the oligomer onto a substrate to form a discrete film of highly associated cyclic oligomer thereon, heat treating the oligomer film to form a modified ladder-type silsesquioxane condensation polymer, and then oxidizing the silsesquioxane in an 0₂ RIE, an organoglass is formed which presents novel etch properties. The organoglass can be used as an etch-stop layer in a passivation process.

公开(公告)号：DE69433769D1

公开(公告)日：2004-06-17

申请号：DE69433769

申请日：1994-03-04

Applicant: IBM

Inventor： O'CONNOR LORETTA JEAN ,  PREVITI-KELLY ROSEMARY ANN ,  REEN THOMAS JOSEPH

IPC: H01L21/28 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46

公开(公告)号：DE69114759D1

公开(公告)日：1996-01-04

申请号：DE69114759

申请日：1991-04-13

Applicant: IBM

Inventor： CRONIN JOHN EDWARD ,  KAANTA CARTER WELLING ,  PREVITI-KELLY ROSEMARY ANN ,  RYAN JAMES GARDNER

IPC: C08L79/08 ,  H01L21/312 ,  H01L21/768 ,  H01L23/528 ,  H01L23/485

公开(公告)号：DE69114346D1

公开(公告)日：1995-12-14

申请号：DE69114346

申请日：1991-04-13

Applicant: IBM

Inventor： CRONIN JOHN EDWARD ,  KAANTA CARTER WELLING ,  PREVITI-KELLY ROSEMARY ANN ,  RYAN JAMES GARDNER ,  LEE PEI-ING PAUL ,  YOON JUNG HOON

IPC: C08G73/10 ,  G03F7/038 ,  H01L21/312 ,  H01L21/768 ,  H01L23/522 ,  H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/46 ,  H01L23/485

公开(公告)号：DE69114346T2

公开(公告)日：1996-06-20

申请号：DE69114346

申请日：1991-04-13

Applicant: IBM

Inventor： CRONIN JOHN EDWARD ,  KAANTA CARTER WELLING ,  PREVITI-KELLY ROSEMARY ANN ,  RYAN JAMES GARDNER ,  LEE PEI-ING PAUL ,  YOON JUNG HOON

IPC: C08G73/10 ,  G03F7/038 ,  H01L21/312 ,  H01L21/768 ,  H01L23/522 ,  H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/46 ,  H01L23/485

公开(公告)号：DE3685906T2

公开(公告)日：1993-02-04

申请号：DE3685906

申请日：1986-04-15

Applicant: IBM

Inventor： CLODGO DONNA JEAN ,  PREVITI-KELLY ROSEMARY ANN ,  WALTON ERICK GREGORY

IPC: H01L21/3205 ,  H01L21/027 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/768 ,  H05K3/14 ,  H01L21/90

公开(公告)号：DE3685906D1

公开(公告)日：1992-08-13

申请号：DE3685906

申请日：1986-04-15

Applicant: IBM

Inventor： CLODGO DONNA JEAN ,  PREVITI-KELLY ROSEMARY ANN ,  WALTON ERICK GREGORY

IPC: H01L21/3205 ,  H01L21/027 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/768 ,  H05K3/14 ,  H01L21/90