公开(公告)号：US3573193A

公开(公告)日：1971-03-30

申请号：US3573193D

申请日：1968-12-04

Applicant: IBM

Inventor： POWERS JOHN V ,  ROMANKIW LUBOMYR T

IPC: H01F10/06 ,  C23F17/00 ,  C23B5/34

CPC classification number: H01F10/06

Abstract: A METHOD FOR CONTROLLING MAGNETIC PROPERTIES OF MAGNETIC FILMS BY CONTROLLING THE ROUGHNESS OF THE SUBSTRATE SURFACE ONTO WHICH THE MAGNETIC FILM IS DEPOSITED. ON ONE HAND THE COERCIVITY MAY BE VARIED ALTHOUGH THE MAGNETIC FILM THICKNESS IS BEING KEPT CONSTANT, ON THE OTHER HAND CONSTANT VALUES OF COERCIVITY CAN BE OBTAINED EVEN THOUGH THE THICKNESS OF THE MAGNETIC FILM MAY VARY. THE SUBSTRATE CONSISTS OF A CONDUCTIVE GROUND PLATE COATED WITH A THIN LAYER OF INSULATING MATERIAL AND THEREAFTER COPPER PLATED. PRIOR TO THE DEPOSITION OF THE MAGNETIC FILM, THE COPPER SURFACE IS TREATED BY ELECTRO PULSE PLATING INCLUDING REVERSE PULSING TO OBTAIN A WELL DEFINED AND CONTROLLED SURFACE ROUGHNESS.

公开(公告)号：US3523824A

公开(公告)日：1970-08-11

申请号：US3523824D

申请日：1966-12-29

Applicant: IBM

Inventor： POWERS JOHN V ,  ROMANKIW LUBOMYR T

IPC: C23C18/20 ,  C23C18/28 ,  H01F10/12 ,  H01F41/24 ,  H01F41/26 ,  G11B5/84

CPC classification number: C23C18/208 ,  C23C18/2006 ,  C23C18/28 ,  C23C18/30 ,  H01F10/12 ,  H01F41/24 ,  H01F41/26

公开(公告)号：US3652442A

公开(公告)日：1972-03-28

申请号：US3652442D

申请日：1970-04-06

Applicant: IBM

Inventor： POWERS JOHN V ,  ROMANKIW LUBOMYR T

IPC: C25D5/00 ,  C25D17/00 ,  H01F17/00 ,  H01F17/06 ,  B01K3/00

CPC classification number: C25D21/10 ,  C25D5/006 ,  C25D5/08 ,  C25D17/12 ,  H01F17/0033 ,  H01F17/06 ,  Y10T29/49073

Abstract: An electroplating cell is constructed to prevent current spreading in the electrolyte during the plating of a metal or metal alloy onto a substrate. The cell is constructed such that the cross-sectional area of current path is substantially the same as the cross-sectional area of a pair of electrodes spaced apart in the cell. This is accomplished by placing the electrodes in the cell such that their edges are substantially in contact with the dielectric or insulating walls of the cell. The cell also contains electrolyte agitating means to provide uniform laminar flow of the electrolyte across the surface of one of the electrode. Metal alloy films deposited with the use of this cell exhibit uniform thicknesses on rather large surface areas. Where magnetic metal alloys are plated, the films not only exhibit uniform thicknesses laterally on the whole cathode but uniform composition and magnetic properties throughout as well.

Abstract translation: 构造电镀单元以防止在将金属或金属合金电镀到基底上时电解液中的电流扩散。 电池被构造成使得电流路径的横截面面积与电池中间隔开的一对电极的横截面面积基本相同。 这通过将电极放置在电池中使得它们的边缘基本上与电池的电介质或绝缘壁接触来实现。 电池还包含电解质搅拌装置，以使得电解质在电极之一的表面上均匀地层流。 使用该电池沉积的金属合金膜在相当大的表面积上表现出均匀的厚度。 在电镀金属合金的情况下，薄膜不仅在整个阴极上横向显示出均匀的厚度，而且整体上的组成和磁性均匀。

公开(公告)号：US3406107A

公开(公告)日：1968-10-15

申请号：US41659464

申请日：1964-12-07

Applicant: IBM

Inventor： GREBE KURT R ,  POWERS JOHN V

IPC: C25D3/46

CPC classification number: C25D3/46

公开(公告)号：CA1141695A

公开(公告)日：1983-02-22

申请号：CA288228

申请日：1977-10-06

Applicant: IBM

Inventor： CASTELLANI EUGENE E ,  POWERS JOHN V ,  ROMANKIW LUBOMYR T

IPC: C25D7/00 ,  C25D3/56 ,  C25D5/08 ,  C25D17/00 ,  C25D21/12 ,  G11B5/31 ,  G11B5/858 ,  H01F10/14 ,  H01F41/14 ,  H01F41/26 ,  C25D5/02

Abstract: MAGNETOSTRICTIVE ALLOY THIN FILM ELECTROPLATING METHOD A thin film of low magnetostriction Permalloy* 80% nickel - 20% iron ? 1% is electroplated onto a substrate in a bath having a ratio of from 5.8:1 to 23:1 ratio of Ni to Fe ions with a plating current density from 10 ma/cm2 - 200 ma/cm2 when plating in sheet form or an Ni/Fe ratio of from 25:1 to 86:1 with a current density of from 2 ma/cm2 - 60 ma/cm2 when plating through a mask. The fluid in the system is constantly mixed, replenished with fresh iron, acid, and other reagents, is adjusted in temperature and subjected to a continuous laminar regime of mixing. The Fe++ ion concentration required is inverse to the circulation of bath fluid across the substrate. Fresh solution is added to the bath from a reservoir where the above adjustments are made. The inlet for the fresh solution is at the lower end of the plating chamber and directed at a bath mixer which includes a slot through which the fresh solution is directed to optimize mixing in the plating chamber. Complexing agents are avoided. High speed plating is obtained with about 24.4 g/l of Ni++, 1.05 g/l of Fe ++, 25 g/l of H3BO3, 0.2 g/l of Na saccharin and a pH of 1.5 to 3.6. * Trade Mark

公开(公告)号：CA1128206A

公开(公告)日：1982-07-20

申请号：CA338282

申请日：1979-10-24

Applicant: IBM

Inventor： COX DANIEL E ,  KANE SUSAN M ,  POWERS JOHN V

IPC: G11C11/14 ,  G11C19/08 ,  H01F10/06 ,  H01F10/12 ,  H01F10/13 ,  H01F41/14 ,  H01F41/34

Abstract: BUBBLE DEVICE FABRICATION A single level masking process for producing microelectronic structures, such as magnetic bubble domain devices, which require very fine line widths. This is a subtractive dry process using a very thin, additively plated mask in order to obtain optimum lithographic resolution. Use of the very thin plated mask eliminates the need for a thick resist layer which would adversely affect resolution. In one example, a double layer metallurgy comprising a conductor layer (such as Au) and an overlying magnetically soft layer (such as NiFe) is patterned using a thin Ti (or Cr) mask. The Ti mask is subtractively patterned using a NiFe mask which is itself patterned by electroplating through a thin resist layer. The double layer NiFe/Au structure is patterned to provide devices having high aspect ratio, good pattern acuity, and uniform thicknesses, where the minimum feature is 1 micron or less. Y0978-043

公开(公告)号：FR2376229A1

公开(公告)日：1978-07-28

申请号：FR7735669

申请日：1977-11-21

Applicant: IBM

Inventor： CASTELLANI EUGENE E ,  POWERS JOHN V ,  ROMANKIW LUBOMYS T

IPC: C25D7/00 ,  C25D3/56 ,  C25D5/08 ,  C25D17/00 ,  C25D21/12 ,  G11B5/31 ,  G11B5/858 ,  H01F10/14 ,  H01F41/14 ,  H01F41/26

Abstract: A thin film of low magnetostriction Permalloy 80% nickel - 20% iron +/- 1% is electroplated in a bath having a ratio of about 1.8:1 to 24:1 g/liter ratio of Ni to Fe ions with a plating current density from 10 ma/cm2 - 200 ma/cm2 when plating in sheet form or an Ni/Fe ratio of 25:1 to 85:1 with a current density of 2 ma/cm2 - 110 ma/cm2 when plating through a mask. The fluid in the system is constantly mixed, replenished with fresh iron, acid, and other reagents, is adjusted in temperature and subjected to a continuous laminar regime of mixing. Fresh solution is added to the bath from a reservoir where the above adjustments are made. The inlet for the fresh solution is at the lower end of the plating chamber and directed at a bath mixer which includes a slot through which the fresh solution is directed to optimize mixing in the plating chamber. Complexing agents are avoided. High speed plating is obtained with about 24.4 g/l of Ni++, 1.05 g/l of Fe++, 25 g/l of H3BO3, 0.2 g/l of Na saccharin and a pH of 1.5 to 3.6.

公开(公告)号：FR2303379A1

公开(公告)日：1976-10-01

申请号：FR7601477

申请日：1976-01-14

Applicant: IBM

Inventor： AHN KIE Y ,  HATZAKIS MICHAEL ,  POWERS JOHN V

IPC: G11C11/14 ,  H01F10/12 ,  H01F10/13 ,  H01F41/14 ,  H01F41/34 ,  H01L21/3205 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H01L21/64 ,  H01L49/02

公开(公告)号：CA832429A

公开(公告)日：1970-01-20

申请号：CA832429D

Applicant: IBM

Inventor： ROMANKIW LUBOMYR T ,  POWERS JOHN V

公开(公告)号：CA1159792A

公开(公告)日：1984-01-03

申请号：CA410149

申请日：1982-08-25

Applicant: IBM

Inventor： CASTELLANI EUGENE E ,  POWERS JOHN V ,  ROMANKIW LUBOMYR T

IPC: C25D3/56

Abstract: MAGNETOSTRICTIVE ALLOY THIN FILM ELECTROPLATING METHOD A thin film of low magnetostriction Permalloy* 80% nickel - 20% iron + 1% is electroplated onto a substrate in a bath having a ratio of from 5.8:1 to 23:1 ratio of Ni to Fe ions with a plating current density from 10 ma/cm2 - 200 ma/cm2 when plating in sheet form or an Ni/Fe ratio of from 25:1 to 86:1 with a current density of from 2 ma/cm2 - 60 ma/cm2 when plating through a mask. The fluid in the system is constantly mixed, replenished with fresh iron, acid, and other reagents, is adjusted in temperature and subjected to a continuous laminar regime of mixing. The Fe++ ion concentration required is inverse to the circulation of bath fluid across the substrate. Fresh solution is added to the bath from a reservoir where the above adjustments are made. The inlet for the fresh solution is at the lower end of the plating chamber and directed at a bath mixer which includes a slot through which the fresh solution is directed to optimize mixing in the plating chamber. Complexing agents are avoided. High speed plating is obtained with about 24.4 g/l of Ni++, 1.05 g/l of Fe , 25 g/l of H3BO3, 0.2 g/l of Na saccharin and a pH of 1.5 to 3.6. * Trade Mark