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Patent Agency Ranking
公开(公告)号：DE3065445D1
公开(公告)日：1983-12-08
申请号：DE3065445
申请日：1980-05-09
Applicant: IBM
IPC: H01L23/42 , H01L23/373 , H01L23/433 , H01L23/36
Abstract: An improved arrangement for cooling a module packaged semiconductor integrated circuit chip having heat generating microcircuits thereon is disclosed. Enhanced cooling over prior art techniques is achieved by utilizing an interfacial layer of liquid metal alloy coated metallic dendrites, which layer is sandwiched between two facing surfaces of the chip and a heat sink. Appropriate biasing means are also provided to urge the dendritic projections into piercing engagement with the liquid metal alloy layer, the biasing means being thermally coupled between the heat sink and the module container to thereby aid in forming unitary heat transfer path from the chip to the module container. The biasing means are adapted to provide sufficient force to cause the dendritic projections to engage and retain the liquid metal alloy layer and to non-destructively force the layer to fill all available space between the chip and the heat sink.
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公开(公告)号：DE69331346D1
公开(公告)日：2002-01-24
申请号：DE69331346
申请日：1993-06-07
Applicant: IBM
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