公开(公告)号：DE3065445D1

公开(公告)日：1983-12-08

申请号：DE3065445

申请日：1980-05-09

Applicant: IBM

Inventor： BABUKA ROBERT ,  HEATH ROBERT ELLIS ,  SAXENMEYER JR GEORGE JOHN ,  SCHULTZ LEWIS KEATING

IPC: H01L23/42 ,  H01L23/373 ,  H01L23/433 ,  H01L23/36

Abstract: An improved arrangement for cooling a module packaged semiconductor integrated circuit chip having heat generating microcircuits thereon is disclosed. Enhanced cooling over prior art techniques is achieved by utilizing an interfacial layer of liquid metal alloy coated metallic dendrites, which layer is sandwiched between two facing surfaces of the chip and a heat sink. Appropriate biasing means are also provided to urge the dendritic projections into piercing engagement with the liquid metal alloy layer, the biasing means being thermally coupled between the heat sink and the module container to thereby aid in forming unitary heat transfer path from the chip to the module container. The biasing means are adapted to provide sufficient force to cause the dendritic projections to engage and retain the liquid metal alloy layer and to non-destructively force the layer to fill all available space between the chip and the heat sink.

公开(公告)号：DE2816328A1

公开(公告)日：1978-10-19

申请号：DE2816328

申请日：1978-04-14

Applicant: IBM

Inventor： BABUKA ROBERT ,  HEATH ROBERT ELLIS ,  SAXENMEYER JUN GEORGE JOHN ,  SCHULTZ LEWIS KEATING

IPC: C25D5/16 ,  H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H01R13/28 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01H1/06 ,  H01L23/50

Abstract: An electrical contact device consists of a substrate having a dendritic array which is grown on it and the dendrites are adapted to releasably engage corresponding dendrites on a mating surface. A typical contact comprises a conducting base plate (11) bearing a group of elastic metallic projections (13). For this purpose a suitable base plate consists of a substrate with a coating of noble metal (15) on which the dendrite crystals are formed. A second electrical contact is similarly formed of a conducting base plate (21) with closely spaced, elastic metallic projections (23). On being brought together the dendritic crystals interlock to form a good electrical connection which can, however, be readily separated. The technique is suitable for connections to LSI integrated circuits.