中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

5 records (took 0.017 seconds)

    2.
    发明专利
    未知

    公开(公告)号：DE69003333T2

    公开(公告)日：1994-04-21

    申请号：DE69003333

    申请日：1990-07-07

    Applicant: IBM

    Inventor： KANG SUNG KWON ,  PALMER MICHEAL JON ,  REILEY TIMOTHY CLARK ,  TOPA ROBERT DAVID

    IPC: B23K20/02 ,  B23K20/233 ,  B23K33/00 ,  H01L21/60 ,  H01L21/603 ,  H01L21/00

    Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

    3.
    发明专利
    未知

    公开(公告)号：DE69003333D1

    公开(公告)日：1993-10-21

    申请号：DE69003333

    申请日：1990-07-07

    Applicant: IBM

    Inventor： KANG SUNG KWON ,  PALMER MICHEAL JON ,  REILEY TIMOTHY CLARK ,  TOPA ROBERT DAVID

    IPC: B23K20/02 ,  B23K20/233 ,  B23K33/00 ,  H01L21/60 ,  H01L21/603 ,  H01L21/00

    Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

Patent Agency Ranking