METHOD FOR FORMING SEMICONDUCTOR STRUCTURE INCLUDING DEEP TRENCH COLLAR

    公开(公告)号:JP2002026148A

    公开(公告)日:2002-01-25

    申请号:JP2001189096

    申请日:2001-06-22

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a new deep trench(DT) collar process which reduces disturbance of strap diffusion to an array metal oxide semiconductor field effect transistor(MOSFET) of a semiconductor device. SOLUTION: By this method, an oxidation barrier layer is formed on a sidewall of the DT provided in the semiconductor substrate, a photoresist layer of specific depth is provided in the trench to remove the oxidation barrier layer to specific depth and expose the trench sidewall, and the remaining photoresist is removed. A layer of a silicon material is stuck on the exposed trench sidewall, and a dielectric layer is formed on the silicon material layer to form a collar. The remaining oxidation barrier layer is removed from the trench and polysilicon which forms a storage node is charged. Consequently, the distance between a MOSFET gate and a DT storage capacitor is maximized, and the effective edge bias of the DT at its peak is reducible without spoiling the storage capacity.

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