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公开(公告)号:JP2002026148A
公开(公告)日:2002-01-25
申请号:JP2001189096
申请日:2001-06-22
Applicant: IBM
Inventor: MANDELMAN JACK A , DIVAKARUNI RAMACHANDRA , RADENS CARL J , GRUENING ULRIKE , SUDO AKIRA
IPC: H01L27/108 , H01L21/8242
Abstract: PROBLEM TO BE SOLVED: To provide a new deep trench(DT) collar process which reduces disturbance of strap diffusion to an array metal oxide semiconductor field effect transistor(MOSFET) of a semiconductor device. SOLUTION: By this method, an oxidation barrier layer is formed on a sidewall of the DT provided in the semiconductor substrate, a photoresist layer of specific depth is provided in the trench to remove the oxidation barrier layer to specific depth and expose the trench sidewall, and the remaining photoresist is removed. A layer of a silicon material is stuck on the exposed trench sidewall, and a dielectric layer is formed on the silicon material layer to form a collar. The remaining oxidation barrier layer is removed from the trench and polysilicon which forms a storage node is charged. Consequently, the distance between a MOSFET gate and a DT storage capacitor is maximized, and the effective edge bias of the DT at its peak is reducible without spoiling the storage capacity.
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公开(公告)号:JP2002026146A
公开(公告)日:2002-01-25
申请号:JP2001180648
申请日:2001-06-14
Applicant: IBM
Inventor: DIVAKARUNI RAMA , JAMMY RAJARAO , BYOON WAI KIMU , MANDELMAN JACK A , SUDO AKIRA , TOBBEN DIRK
IPC: H01L21/8242 , H01L27/108 , H01L29/94
Abstract: PROBLEM TO BE SOLVED: To provide a structure and a method for a trench-type capacitor improved in its charge holding capability. SOLUTION: The memory device includes a trench 23 which is formed on a substrate and has an upper part. A collar oxide film 21 is arranged at the upper part of the trench. A collar oxide film includes a pedestal 25. A conductor is charged in the trench. The pedestal reduces a leak of charges in the conductor. The method for forming the memory device, having the collar oxide film having the pedestal collar, is also disclosed.
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