公开(公告)号：JP2001267325A

公开(公告)日：2001-09-28

申请号：JP2001031135

申请日：2001-02-07

Applicant: IBM

Inventor： NYE III HENRY A ,  MCGAHAY VINCENT J ,  TALLMAN KURT A

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/77 ,  H01L23/00 ,  H01L23/58

Abstract: PROBLEM TO BE SOLVED: To provide a copper interconnecting integrated circuit of low permittivity, where corrosion of interconnection is reduced, when a crack stopper adjacent to a trimmed edge is used also as a primary barrier to diffusion of oxygen in dielectrics. SOLUTION: A corresponding crack stopper element is formed simultaneously with formation of a circuit interconnection element. For example, a horizontal interconnection element has a structure corresponding to the crack stopper, and a via between interconnection layers also has a structure corresponding to the crack stopper.

公开(公告)号：MY119966A

公开(公告)日：2005-08-30

申请号：MYPI20010319

申请日：2001-01-23

Applicant: IBM

Inventor： NYE HENRY A III ,  MCGAHAY VINCENT J ,  TALLMAN KURT A

IPC: H01L21/4763 ,  H01L21/3205 ,  H01L23/52 ,  H01L21/768 ,  H01L21/77 ,  H01L23/00 ,  H01L23/58

Abstract: A COPPER-INTERCONNECT (126, 136, 146), LOW-K DIELECTRIC (10) INTEGRATED CIRCUIT HAS REDUCED CORROSION OF THE INTERCONNECT WHEN THE CRACKSTOP (2) NEXT TO THE KERF IS ALSO USED AS THE PRIMACY BARRIER TO OXYGEN DIFFUSION THROUGH THE DIELECTRIC, WITH CORRESPONDING ELEMENTS (112, 122, 132, 142) OF THE CRACKSTOP BEING CONSTRUCTED SIMULTANEOUSLY WITH THE CIRCUIT INTERCONNECT ELEMENTS; E.G. HORIZONTAL INTERCONNECT ELEMENTS HAVE A CORRESPONDING STRUCTURE IN THE CRACKSTOP AND VIAS BETWEEN INTERCONNECT LAYERS HAVE CORRESPONDING STRUCTURES IN THE CRACKSTOP.