公开(公告)号：JP2001267325A

公开(公告)日：2001-09-28

申请号：JP2001031135

申请日：2001-02-07

Applicant: IBM

Inventor： NYE III HENRY A ,  MCGAHAY VINCENT J ,  TALLMAN KURT A

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/77 ,  H01L23/00 ,  H01L23/58

Abstract: PROBLEM TO BE SOLVED: To provide a copper interconnecting integrated circuit of low permittivity, where corrosion of interconnection is reduced, when a crack stopper adjacent to a trimmed edge is used also as a primary barrier to diffusion of oxygen in dielectrics. SOLUTION: A corresponding crack stopper element is formed simultaneously with formation of a circuit interconnection element. For example, a horizontal interconnection element has a structure corresponding to the crack stopper, and a via between interconnection layers also has a structure corresponding to the crack stopper.