1.
    发明专利
    未知

    公开(公告)号:DE3689341D1

    公开(公告)日:1994-01-13

    申请号:DE3689341

    申请日:1986-03-11

    Applicant: IBM

    Abstract: A metal silicide-silicon structure (FIG. 2) is produced by depositing the same metal (M) on first (12) and second (13) silicon regions and forming, in a single thermal conversion step, different metal silicide phases (MS1, MS2) on the first and second silicon regions owing to a difference in the dopant and/or dopant level between the first and second silicon regions. The different metal silicide phases can be tailored for different applications, including ohmic contacts, diode barrier contacts, interconnection lines, gate contacts, and diffusion barriers.

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