公开(公告)号：CA1277435C

公开(公告)日：1990-12-04

申请号：CA570925

申请日：1988-06-30

Applicant: IBM

Inventor： GAJDA JOSEPH J ,  SRIKRISHNAN KRIS V ,  TOTTA PAUL A ,  TRUDEAU FRANCIS G

IPC: H01L21/3205 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L23/522 ,  H01L21/90

Abstract: Chip Contacts Without Opens An integrated circuit chip including a first and a higher second surface levels with an abrupt sidewall step transition therebetween, and having a first layer of a first conductive material disposed over the first surface level and over the second surface level, but terminating on the first surface level in a first end portion which extends up to but does not touch the sidewall. This end portion comprises a conductive material which has been converted to an insulator. A second layer of a second conductive material is disposed on top of the first conductive layer with essentially no conductive material conversion to insulator therein adjacent to the abrupt sidewall transition. In a preferred embodiment, the conductive material is an alloy of aluminum and the end portion is aluminum oxide.