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公开(公告)号:US3432830A
公开(公告)日:1969-03-11
申请号:US3432830D
申请日:1964-11-20
Applicant: IBM
Inventor: OWEN CHARLES E , TAUB DANIEL M , WARWICK WILLIAM A
CPC classification number: G11C17/02 , Y10T29/49069
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公开(公告)号:CA1155984A
公开(公告)日:1983-10-25
申请号:CA357088
申请日:1980-07-25
Applicant: IBM
Inventor: WARWICK WILLIAM A
Abstract: LIGHT PEN A light pen for detecting radiation from a display screen has a tubular body with a conical tip. The tip which fastens into the pen body includes an opaque bush which has a bore having a precisely determined diameter for transmitting light from an aperture in the tip to a light sensing device mounted in the body of the pen. The bore or interior surface of the bush has a surface formed to eliminate internal reflection.
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公开(公告)号:FR2292336A1
公开(公告)日:1976-06-18
申请号:FR7530732
申请日:1975-10-01
Applicant: IBM
Inventor: WARWICK WILLIAM A
IPC: H01L21/822 , H01L21/60 , H01L21/82 , H01L23/538 , H01L27/00 , H01L27/02 , H01L27/04 , H01L23/50
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公开(公告)号:CA1111486A
公开(公告)日:1981-10-27
申请号:CA310049
申请日:1978-08-25
Applicant: IBM
Inventor: SOWTER BRIAN R , WARWICK WILLIAM A
Abstract: CONVERGENCE ASSEMBLY FOR CATHODE RAY TUBE An electromagnetic lateral convergence assembly includes a generallyannular, planar magnetic core (optionally found as a laminate) having six integral pole pieces extending towards the centre of the annulus. Electrical coils are mounted on selected polepieces for producing a convergence-compensating magnetic field within the centre of the annulus. The coils are secured to a printed circuit board to hold the core in spaced parallel relationship to the board. Optionally a purity assembly including a planar magnetic core having a number of electrical coils for producing a rotatable, variable, linear field is mounted on the other side of the printed circuit board.
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公开(公告)号:CA1038086A
公开(公告)日:1978-09-05
申请号:CA238426
申请日:1975-10-27
Applicant: IBM
Inventor: WARWICK WILLIAM A
IPC: H01L21/822 , H01L21/60 , H01L21/82 , H01L23/538 , H01L27/00 , H01L27/02 , H01L27/04 , H05K1/04
Abstract: IMPROVEMENTS RELATING TO SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES A power bus element for use in large scale integrated circuits is described. Each bus element consists, for example, of a chip of silicon having two levels of metallizationthereon, one acting as an earth (or ground) return plane and the other providing power voltages. Dependent contacts on the chip make selective contact with metallization over the surface of the semiconductor wafer on which the chip is mounted. A power distribution line consists of a number of such bus elements linked together.
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公开(公告)号:CA747568A
公开(公告)日:1966-11-29
申请号:CA747568D
Applicant: IBM
Inventor: BOLTON IVOR W , TAUB DANIEL M , OWEN CHARLES E , GOWER KENNETH N , PROUDMAN ANTONY , WARWICK WILLIAM A
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