LIGHT PEN
    2.
    发明专利

    公开(公告)号:CA1155984A

    公开(公告)日:1983-10-25

    申请号:CA357088

    申请日:1980-07-25

    Applicant: IBM

    Abstract: LIGHT PEN A light pen for detecting radiation from a display screen has a tubular body with a conical tip. The tip which fastens into the pen body includes an opaque bush which has a bore having a precisely determined diameter for transmitting light from an aperture in the tip to a light sensing device mounted in the body of the pen. The bore or interior surface of the bush has a surface formed to eliminate internal reflection.

    CONVERGENCE ASSEMBLY FOR CATHODE RAY TUBE

    公开(公告)号:CA1111486A

    公开(公告)日:1981-10-27

    申请号:CA310049

    申请日:1978-08-25

    Applicant: IBM

    Abstract: CONVERGENCE ASSEMBLY FOR CATHODE RAY TUBE An electromagnetic lateral convergence assembly includes a generallyannular, planar magnetic core (optionally found as a laminate) having six integral pole pieces extending towards the centre of the annulus. Electrical coils are mounted on selected polepieces for producing a convergence-compensating magnetic field within the centre of the annulus. The coils are secured to a printed circuit board to hold the core in spaced parallel relationship to the board. Optionally a purity assembly including a planar magnetic core having a number of electrical coils for producing a rotatable, variable, linear field is mounted on the other side of the printed circuit board.

    POWER DISTRIBUTION BUS FOR INTEGRATED CIRCUITS

    公开(公告)号:CA1038086A

    公开(公告)日:1978-09-05

    申请号:CA238426

    申请日:1975-10-27

    Applicant: IBM

    Abstract: IMPROVEMENTS RELATING TO SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES A power bus element for use in large scale integrated circuits is described. Each bus element consists, for example, of a chip of silicon having two levels of metallizationthereon, one acting as an earth (or ground) return plane and the other providing power voltages. Dependent contacts on the chip make selective contact with metallization over the surface of the semiconductor wafer on which the chip is mounted. A power distribution line consists of a number of such bus elements linked together.

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