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1.发明申请Device Components With Surface-Embedded Additives And Related Manufacturing Methods 有权具有表面嵌入式添加剂的器件组件及相关制造方法公开(公告)号：US20150014022A1
公开(公告)日：2015-01-15
申请号：US14299938
申请日：2014-06-09
Applicant: INNOVA DYNAMICS, INC.
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
CPC classification number: H05K1/09 , H01L31/02167 , H01L31/0481 , H01L31/05 , H01L31/055 , H05K1/0274 , H05K1/0313 , H05K1/115 , H05K2201/0302 , H05K2201/0326 , H05K2201/0364 , H05K2201/10977 , Y02E10/52 , Y02E10/54 , Y02E10/542
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。
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公开(公告)号：US09408297B2
公开(公告)日：2016-08-02
申请号：US14604529
申请日：2015-01-23
Applicant: INNOVA DYNAMICS, INC.
Inventor： Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal , Michael Eugene Young , David Buchanan , Joseph George , Yuka Yoshioka
IPC: H05K1/00 , B23B5/16 , H05K1/03 , H05K1/02 , G06F3/041 , H05K1/09 , H05K3/00 , H05K3/02 , B82Y30/00
CPC classification number: H05K1/0274 , B82Y30/00 , G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0298 , H05K1/09 , H05K3/0091 , H05K3/027 , Y10S977/932 , Y10T428/25 , Y10T428/254
Abstract: A patterned transparent conductor includes: (1) a substrate; (2) first additives at least partially embedded into a surface of the substrate within a first area of the surface corresponding to a lower sheet resistance portion; and (3) second additives at least partially embedded into the surface of the substrate within a second area of the surface corresponding to a higher sheet resistance portion. A sheet resistance of the higher sheet resistance portion is at least 100 times a sheet resistance of the lower sheet resistance portion.
Abstract translation: 图案化的透明导体包括：（1）基底; （2）第一添加剂至少部分地嵌入在与下薄层电阻部分相对应的表面的第一区域内的基板的表面中; 和（3）第二添加剂至少部分地嵌入在与更高的薄层电阻部分相对应的表面的第二区域内的基板的表面中。 较高的薄层电阻部分的薄层电阻是下薄层电阻部分的薄层电阻的至少100倍。
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公开(公告)号：US20140231282A1
公开(公告)日：2014-08-21
申请号：US14262567
申请日：2014-04-25
Applicant: Innova Dynamics, Inc.
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson
Abstract: Methods and articles of manufacture for storage and shipping of nanowires are disclosed. One disclosed method includes: (a) providing a nanowire suspension including nanowires suspended in a liquid; and (b) disposing the nanowire suspension in a container for storage and shipping, where the container is configured to inhibit agglomeration of nanowires from the nanowire suspension.
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公开(公告)号：US20140231281A1
公开(公告)日：2014-08-21
申请号：US14262561
申请日：2014-04-25
Applicant: Innova Dynamics, Inc.
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson
Abstract: Methods and articles of manufacture for storage and shipping of nanowires are disclosed. One disclosed method includes: (a) providing a nanowire suspension including nanowires suspended in a liquid; and (b) disposing the nanowire suspension in a container for storage and shipping, where the container is configured to inhibit agglomeration of nanowires from the nanowire suspension.
Abstract translation: 公开了用于存储和运输纳米线的方法和制品。 一种公开的方法包括：（a）提供包含悬浮在液体中的纳米线的纳米线悬浮液; 和（b）将纳米线悬浮液设置在用于储存和运输的容器中，其中容器被配置为抑制纳米线从纳米线悬浮液的聚集。
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公开(公告)号：US20150129286A1
公开(公告)日：2015-05-14
申请号：US14604529
申请日：2015-01-23
Applicant: INNOVA DYNAMICS, INC.
Inventor： Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal , Michael Eugene Young , David Buchanan , Joseph George , Yuka Yoshioka
CPC classification number: H05K1/0274 , B82Y30/00 , G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0298 , H05K1/09 , H05K3/0091 , H05K3/027 , Y10S977/932 , Y10T428/25 , Y10T428/254
Abstract: A patterned transparent conductor includes: (1) a substrate; (2) first additives at least partially embedded into a surface of the substrate within a first area of the surface corresponding to a lower sheet resistance portion; and (3) second additives at least partially embedded into the surface of the substrate within a second area of the surface corresponding to a higher sheet resistance portion. A sheet resistance of the higher sheet resistance portion is at least 100 times a sheet resistance of the lower sheet resistance portion.
Abstract translation: 图案化的透明导体包括：（1）基底; （2）第一添加剂至少部分地嵌入在与下薄层电阻部分相对应的表面的第一区域内的基板的表面中; 和（3）第二添加剂至少部分地嵌入在与更高的薄层电阻部分相对应的表面的第二区域内的基板表面中。 较高的薄层电阻部分的薄层电阻是下薄层电阻部分的薄层电阻的至少100倍。
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Patent Agency Ranking
公开(公告)号：US08969731B2
公开(公告)日：2015-03-03
申请号：US14299924
申请日：2014-06-09
Applicant: Innova Dynamics, Inc.
Inventor： Arjun Srinivas , Matthew R. Robinson , Alexander Chow Mittal , Michael Eugene Young , David Buchanan , Joseph George , Yuka Yoshioka
CPC classification number: H05K1/0274 , B82Y30/00 , G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0298 , H05K1/09 , H05K3/0091 , H05K3/027 , Y10S977/932 , Y10T428/25 , Y10T428/254
Abstract: A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.
Abstract translation: 图案化的透明导体包括基材和至少部分地嵌入基材的至少一个表面中并且根据图案邻近表面定位的添加剂，以形成更高的片状导电部分。 较高的片材导电部分与下片材导电部分横向相邻。
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7.发明申请STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS 审中-公开具有表面嵌入添加剂的结构和相关制造方法公开(公告)号：US20140299359A1
公开(公告)日：2014-10-09
申请号：US14247033
申请日：2014-04-07
Applicant: Innova Dynamics, Inc.
Inventor： Alexander Chow Mittal , Arjun Daniel Srinivas , Matthew R. Robinson , Michael Eugene Young
CPC classification number: H01B1/22 , B05D1/005 , B05D3/007 , H01L23/373 , H01L31/022466 , H01L31/035209 , H01L31/1884 , H01L51/442 , H01L51/5206 , H01L2924/0002 , H05K1/0271 , H05K1/097 , Y02E10/50 , Y10T428/24364 , Y10T428/24372 , Y10T428/249921 , Y10T428/25 , H01L2924/00
Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 导电或半导体添加剂被嵌入主体材料的表面以用于各种应用和装置中。 所得的表面嵌入结构表现出改善的性能，以及由其组成和制造工艺产生的成本优势。
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8.发明申请DEVICE COMPONENTS WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS 有权具有表面嵌入式添加剂的器件组件及相关制造方法公开(公告)号：US20160029482A1
公开(公告)日：2016-01-28
申请号：US14873567
申请日：2015-10-02
Applicant: INNOVA DYNAMICS, INC.
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
CPC classification number: H05K1/09 , H01L31/02167 , H01L31/0481 , H01L31/05 , H01L31/055 , H05K1/0274 , H05K1/0313 , H05K1/115 , H05K2201/0302 , H05K2201/0326 , H05K2201/0364 , H05K2201/10977 , Y02E10/52 , Y02E10/54 , Y02E10/542
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。
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9.发明授权Device components with surface-embedded additives and related manufacturing methods 有权具有表面嵌入添加剂的器件组件及相关制造方法公开(公告)号：US09185798B2
公开(公告)日：2015-11-10
申请号：US14299938
申请日：2014-06-09
Applicant: INNOVA DYNAMICS, INC.
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
IPC: H01L31/00 , H01L31/048 , H01L31/0216 , H05K1/02 , H01L31/055 , H05K1/09 , H05K1/11
CPC classification number: H05K1/09 , H01L31/02167 , H01L31/0481 , H01L31/05 , H01L31/055 , H05K1/0274 , H05K1/0313 , H05K1/115 , H05K2201/0302 , H05K2201/0326 , H05K2201/0364 , H05K2201/10977 , Y02E10/52 , Y02E10/54 , Y02E10/542
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。
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10.发明申请STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS 审中-公开具有表面嵌入添加剂的结构和相关制造方法公开(公告)号：US20150137049A1
公开(公告)日：2015-05-21
申请号：US14522080
申请日：2014-10-23
Applicant: Innova Dynamics, Inc.
Inventor： Alexander Chow Mittal , Arjun Daniel Srinivas , Matthew R. Robinson , Michael Eugene Young
CPC classification number: H01B1/22 , B05D1/005 , B05D3/007 , H01L23/373 , H01L31/022466 , H01L31/035209 , H01L31/1884 , H01L51/442 , H01L51/5206 , H01L2924/0002 , H05K1/0271 , H05K1/097 , Y02E10/50 , Y10T428/24364 , Y10T428/24372 , Y10T428/249921 , Y10T428/25 , H01L2924/00
Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 导电或半导体添加剂被嵌入主体材料的表面以用于各种应用和装置中。 所得的表面嵌入结构表现出改善的性能，以及由其组成和制造工艺产生的成本优势。
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