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公开(公告)号：US09408297B2
公开(公告)日：2016-08-02
申请号：US14604529
申请日：2015-01-23
Applicant: INNOVA DYNAMICS, INC.
Inventor： Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal , Michael Eugene Young , David Buchanan , Joseph George , Yuka Yoshioka
IPC: H05K1/00 , B23B5/16 , H05K1/03 , H05K1/02 , G06F3/041 , H05K1/09 , H05K3/00 , H05K3/02 , B82Y30/00
CPC classification number: H05K1/0274 , B82Y30/00 , G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0298 , H05K1/09 , H05K3/0091 , H05K3/027 , Y10S977/932 , Y10T428/25 , Y10T428/254
Abstract: A patterned transparent conductor includes: (1) a substrate; (2) first additives at least partially embedded into a surface of the substrate within a first area of the surface corresponding to a lower sheet resistance portion; and (3) second additives at least partially embedded into the surface of the substrate within a second area of the surface corresponding to a higher sheet resistance portion. A sheet resistance of the higher sheet resistance portion is at least 100 times a sheet resistance of the lower sheet resistance portion.
Abstract translation: 图案化的透明导体包括：（1）基底; （2）第一添加剂至少部分地嵌入在与下薄层电阻部分相对应的表面的第一区域内的基板的表面中; 和（3）第二添加剂至少部分地嵌入在与更高的薄层电阻部分相对应的表面的第二区域内的基板的表面中。 较高的薄层电阻部分的薄层电阻是下薄层电阻部分的薄层电阻的至少100倍。
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公开(公告)号：US20150129286A1
公开(公告)日：2015-05-14
申请号：US14604529
申请日：2015-01-23
Applicant: INNOVA DYNAMICS, INC.
Inventor： Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal , Michael Eugene Young , David Buchanan , Joseph George , Yuka Yoshioka
CPC classification number: H05K1/0274 , B82Y30/00 , G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0298 , H05K1/09 , H05K3/0091 , H05K3/027 , Y10S977/932 , Y10T428/25 , Y10T428/254
Abstract: A patterned transparent conductor includes: (1) a substrate; (2) first additives at least partially embedded into a surface of the substrate within a first area of the surface corresponding to a lower sheet resistance portion; and (3) second additives at least partially embedded into the surface of the substrate within a second area of the surface corresponding to a higher sheet resistance portion. A sheet resistance of the higher sheet resistance portion is at least 100 times a sheet resistance of the lower sheet resistance portion.
Abstract translation: 图案化的透明导体包括：（1）基底; （2）第一添加剂至少部分地嵌入在与下薄层电阻部分相对应的表面的第一区域内的基板的表面中; 和（3）第二添加剂至少部分地嵌入在与更高的薄层电阻部分相对应的表面的第二区域内的基板表面中。 较高的薄层电阻部分的薄层电阻是下薄层电阻部分的薄层电阻的至少100倍。
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公开(公告)号：US08969731B2
公开(公告)日：2015-03-03
申请号：US14299924
申请日：2014-06-09
Applicant: Innova Dynamics, Inc.
Inventor： Arjun Srinivas , Matthew R. Robinson , Alexander Chow Mittal , Michael Eugene Young , David Buchanan , Joseph George , Yuka Yoshioka
CPC classification number: H05K1/0274 , B82Y30/00 , G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0298 , H05K1/09 , H05K3/0091 , H05K3/027 , Y10S977/932 , Y10T428/25 , Y10T428/254
Abstract: A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.
Abstract translation: 图案化的透明导体包括基材和至少部分地嵌入基材的至少一个表面中并且根据图案邻近表面定位的添加剂，以形成更高的片状导电部分。 较高的片材导电部分与下片材导电部分横向相邻。
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公开(公告)号：US20140284083A1
公开(公告)日：2014-09-25
申请号：US14299924
申请日：2014-06-09
Applicant: INNOVA DYNAMICS, INC.
Inventor： Arjun Srinivas , Matthew R. Robinson , Alexander Chow Mittal , Michael Eugene Young , David Buchanan , Joseph George , Yuka Yoshioka
CPC classification number: H05K1/0274 , B82Y30/00 , G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0298 , H05K1/09 , H05K3/0091 , H05K3/027 , Y10S977/932 , Y10T428/25 , Y10T428/254
Abstract: A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.
Abstract translation: 图案化的透明导体包括基材和至少部分地嵌入基材的至少一个表面中并且根据图案邻近表面定位的添加剂，以形成更高的片状导电部分。 较高的片材导电部分与下片材导电部分横向相邻。
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