公开(公告)号：US08547548B1

公开(公告)日：2013-10-01

申请号：US13721019

申请日：2012-12-20

Applicant: Kinsus Interconnect Technology Corp.

Inventor： Chia-Chi Lo ,  Cheng-Hsiung Yang Yang ,  Jun-Chung Hsu

IPC: G01N21/00

CPC classification number: G01N21/8803 ,  G01N2021/8861 ,  G01N2021/888

Abstract: Disclosed is a final defect inspection system, which including a host device, a microscope, a bar code scanner, a support tool, a signal transceiver and an electromagnetic pen. The bar code scanner scans a bar code on a circuit board provided on the support plate. The host device selects data and a circuit layout diagram from the database corresponding to the bar code. The signal transceiver and the electromagnetic pen are electrically connected to the host device. The electromagnetic pen is used to make a mark on a scrap region of the circuit board where any defect is visually found through the microscope. The signal transceiver receives and transmits the positions of the mark to the host device such that the host device calculates the coordinate of a scrap region based on a relative position between an original point and the positions of the mark.

Abstract translation: 公开了一种最终缺陷检查系统，其包括主机，显微镜，条形码扫描器，支持工具，信号收发器和电磁笔。 条形码扫描器扫描设置在支撑板上的电路板上的条形码。 主机设备从与条形码对应的数据库中选择数据和电路布局图。 信号收发器和电磁笔电连接到主机设备。 电磁笔用于在电路板的废料区域上形成标记，其中通过显微镜在视觉上发现任何缺陷。 信号收发器接收和发送标记的位置到主机设备，使得主机设备基于原始点和标记位置之间的相对位置来计算废料区域的坐标。

公开(公告)号：US08837808B2

公开(公告)日：2014-09-16

申请号：US13721015

申请日：2012-12-20

Applicant: Kinsus Interconnect Technology Corp.

Inventor： Chia-Chi Lo ,  Cheng-Hsiung Yang ,  Jun-Chung Hsu

IPC: G06K9/00 ,  G06T7/00

CPC classification number: H05K1/0269 ,  H05K3/0008 ,  H05K3/225 ,  H05K2201/09927 ,  H05K2201/09936

Abstract: Disclosed is a method of final defect inspection, including preparing a final defect inspection apparatus which includes a host device, a microscope, a bar code scanner, a support tool and a signal transceiver, using the host device to calibrate an original point in an outline of the circuit board based on a plurality of original mark positions generated by an electromagnetic pen, using the electromagnetic pen to mark each defect position on the inspection region on the circuit board where any defect is found through the microscope, using the signal transceiver to receive and transmit each defect position to the host device, and using the host device to calculate the coordinate of a scrap region based on a relative position between the original point and each defect position so as to generate a shipment file.

Abstract translation: 公开了一种最终缺陷检查的方法，包括使用主机设备准备包括主机，显微镜，条形码扫描仪，支持工具和信号收发器的最终缺陷检查设备来校准轮廓中的原始点 基于由电磁笔产生的多个原始标记位置的电路​​板，使用电磁笔来标记电路板上通过显微镜发现任何缺陷的检查区域上的每个缺陷位置，使用信号收发器接收 并且将每个缺陷位置发送到主机设备，并且使用主机设备基于原始点和每个缺陷位置之间的相对位置来计算废料区域的坐标，以便生成出货文件。

公开(公告)号：US20140177939A1

公开(公告)日：2014-06-26

申请号：US13721015

申请日：2012-12-20

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Chia-Chi Lo ,  Cheng-Hsiung Yang ,  Jun-Chung Hsu

IPC: G06T7/00

CPC classification number: H05K1/0269 ,  H05K3/0008 ,  H05K3/225 ,  H05K2201/09927 ,  H05K2201/09936

Abstract: Disclosed is a method of final defect inspection, including preparing a final defect inspection apparatus which includes a host device, a microscope, a bar code scanner, a support tool and a signal transceiver, using the host device to calibrate an original point in an outline of the circuit board based on a plurality of original mark positions generated by an electromagnetic pen, using the electromagnetic pen to mark each defect position on the inspection region on the circuit board where any defect is found through the microscope, using the signal transceiver to receive and transmit each defect position to the host device, and using the host device to calculate the coordinate of a scrap region based on a relative position between the original point and each defect position so as to generate a shipment file.

Abstract translation: 公开了一种最终缺陷检查的方法，包括使用主机设备准备包括主机，显微镜，条形码扫描仪，支持工具和信号收发器的最终缺陷检查设备来校准轮廓中的原始点 基于由电磁笔产生的多个原始标记位置的电路​​板，使用电磁笔来标记电路板上通过显微镜发现任何缺陷的检查区域上的每个缺陷位置，使用信号收发器接收 并且将每个缺陷位置发送到主机设备，并且使用主机设备基于原始点和每个缺陷位置之间的相对位置来计算废料区域的坐标，以便生成出货文件。