公开(公告)号：US09831167B1

公开(公告)日：2017-11-28

申请号：US15678130

申请日：2017-08-16

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yi-Fan Kao ,  Shuo-Hsun Chang ,  Yu-Te Lu ,  Kuo-Chun Huang

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/13 ,  H01L23/00 ,  H01L21/56 ,  H01L23/538 ,  H01L21/48 ,  H01L23/367

CPC classification number: H01L23/49833 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/061 ,  H01L2924/00

Abstract: A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with an opening bonded to a carrier board in order to form a compound carrier board structure. A die is placed in the opening and bonded to the carrier board. A sealant is filled in a gap between surrounding walls of the opening and the die at a height lower than the die to fixedly place the die within the opening and to leave a non-active surface of the die exposed.

公开(公告)号：US09754870B2

公开(公告)日：2017-09-05

申请号：US15071368

申请日：2016-03-16

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yi-Fan Kao ,  Shuo-Hsun Chang ,  Yu-Te Lu ,  Kuo-Chun Huang

IPC: H01L23/498 ,  H01L23/31 ,  H05K3/46 ,  H01L23/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L23/49833 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/061 ,  H01L2924/00

Abstract: A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with a penetrating rectangular opening bonded to a non-conductive film then a carrier board in order to form a compound carrier board structure. The baseplate is constructed with a low Thermal Expansion Coefficient material.

公开(公告)号：US09406641B2

公开(公告)日：2016-08-02

申请号：US13938335

申请日：2013-07-10

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yi-Fan Kao ,  Shuo-Hsun Chang ,  Yu-Te Lu ,  Kuo-Chun Huang

IPC: H01L23/00 ,  H01L23/31 ,  H05K3/46 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H01L25/10

CPC classification number: H01L24/81 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/562 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/061 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate having a flip region with a through-opening and bonding to a Non-conductive Film to bond to a carrier board in order to form a compound carrier board structure. The baseplate is constructed with a low Thermal Expansion Coefficient material.

Abstract translation: Flip-Chip Chip-Scale封装的复合载体板结构及其制造方法提供了一种具有通孔的翻转区和与非导电膜结合以结合到载体板以形成化合物载体的底板 板结构。 底板由低热膨胀系数材料构成。