公开(公告)号：US20180160533A1

公开(公告)日：2018-06-07

申请号：US15369822

申请日：2016-12-05

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao LIN ,  Chiao-Cheng CHANG ,  Yi-Nong LIN

IPC: H05K1/14 ,  H05K1/02 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K3/4641 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2201/10242 ,  H05K2203/041 ,  H05K2203/0568

Abstract: A multilayer printed circuit board includes a first circuit board, a second circuit board and bonding films. The first circuit board includes a first dielectric layer, a first wiring pattern layer, a plurality of conductive blocks and a plurality of solder balls. The first wiring pattern layer is formed on a first surface of the first dielectric layer and the conductive blocks are formed on a second surface of the first dielectric layer. The solder balls are formed on a surface of the first wiring pattern layer. The second circuit board includes a second dielectric layer, a second wiring pattern layer, second conductive blocks and conductive pillars. The second wiring pattern layer is formed on a third surface of the second dielectric layer and the second conductive blocks are formed on a fourth surface thereof. The conductive pillars are formed on the second wiring pattern layer.

公开(公告)号：US20180332706A1

公开(公告)日：2018-11-15

申请号：US16045236

申请日：2018-07-25

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao LIN ,  Chiao-Cheng CHANG ,  Yi-Nong LIN

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/46 ,  H05K3/42 ,  H05K3/18 ,  H05K3/10

Abstract: A landless multilayer circuit board includes a first substrate, a first circuit, at least one connecting pillar, a second substrate, and a second circuit. The second substrate is on the surface of the first substrate, covering the first circuit, and exposing at least one top of the at least one connecting pillar exposed out of a surface of the second substrate, wherein an area of a portion of the at least one connecting pillar that is exposed out of the surface of the second substrate is greater than an area of a portion of the at least one connecting pillar that is connected to the first circuit. The second circuit is on the surface of the second substrate and the at least one connecting pillar, and connected to the portion of the at least one connecting pillar that is exposed out of the surface of the second substrate.

公开(公告)号：US20170303397A1

公开(公告)日：2017-10-19

申请号：US15130724

申请日：2016-04-15

Applicant: Kinsus Interconnect Technology Corp.

Inventor： Ting-Hao LIN ,  Chiao-Cheng CHANG ,  Yi-Nong LIN

IPC: H05K1/11 ,  H05K3/42 ,  H05K3/18 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K1/113 ,  H05K3/0047 ,  H05K3/0079 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/18 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4647 ,  H05K2203/054 ,  Y10T29/49165

Abstract: Provided is a landless multilayer circuit board and a manufacturing method thereof. The manufacturing method includes steps of forming a first circuit on a first substrate, patterning a photoresist layer to form at least one via between the first circuit and a second circuit, forming at least one connecting pillar in the at least one via, removing the photoresist layer, forming a second substrate to cover the at least one connect pillar, and forming the second circuit on the second substrate. The second circuit is connected to the first circuit through the at least one connecting pillar. When the second circuit is formed, the at least one via does not need to be filled, thereby making the second circuit flat.