公开(公告)号：US20150271915A1

公开(公告)日：2015-09-24

申请号：US14223661

申请日：2014-03-24

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Jun-Chung Hsu ,  Bo-Yu Tseng ,  Yu-Hsiang Sun

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0271 ,  H05K1/0206 ,  H05K1/0298 ,  H05K3/3436

Abstract: An enhanced chip board package structure includes a chip board and a plurality of enhanced structures, which are formed in the blind openings of the non-effective region of the chip board. Each enhanced structure has an opening. The mechanical strength is reinforced by the enhanced structures without changing the whole thickness so as to overcome the problem of warping. Meanwhile, the three-dimensional stability is thus enhanced. The opening of the enhanced structure can be selectively filled with the filler such that the mechanical strength is further reinforced and the thermally conductive effect is greatly improved.

Abstract translation: 增强的芯片板封装结构包括芯片板和多个增强结构，其形成在芯片板的非有效区域的盲孔中。 每个增强结构都有一个开口。 机械强度通过增强的结构增强，而不改变整个厚度，从而克服翘曲的问题。 同时，三维稳定性得到提高。 增强结构的开口可以选择性地填充填料，使得机械强度进一步增强，导热效果大大提高。