公开(公告)号：WO2004030084A3

公开(公告)日：2004-06-24

申请号：PCT/US0330610

申请日：2003-09-24

Applicant: LAM RES CORP ,  BAILEY ANDREW D III ,  YADAV PUNEET ,  MISRA PRATIK

Inventor： BAILEY ANDREW D III ,  YADAV PUNEET ,  MISRA PRATIK

IPC: H01L21/66

CPC classification number: H01L22/20

Abstract: A system and method of for determining multiple uniformity metrics of a semiconductor wafer manufacturing process includes collecting a quantity across each one of a group of semiconductor wafers. The collected quantity data is scaled and a principal component analysis (PCA) is performed on the collected, scaled quantity data to produce a first set of metrics for the first group of semiconductor wafers. The first set of metrics including a first loads matrix and a first scores matrix.

Abstract translation: 用于确定半导体晶片制造工艺的多个均匀性度量的系统和方法包括收集跨越一组半导体晶片中的每一个的数量。 收集的数量数据被缩放并且对收集的缩放量数据执行主成分分析（PCA）以产生用于第一组半导体晶片的第一组度量。 第一组度量包括第一加载矩阵和第一分数矩阵。

公开(公告)号：AU2003277020A1

公开(公告)日：2004-04-19

申请号：AU2003277020

申请日：2003-09-24

Applicant: LAM RES CORP

Inventor： YADAV PUNEET ,  MISRA PRATIK ,  BAILEY ANDREW D III

IPC: H01L21/66

Abstract: A system and method of for determining multiple uniformity metrics of a semiconductor wafer manufacturing process includes collecting a quantity across each one of a group of semiconductor wafers. The collected quantity data is scaled and a principal component analysis (PCA) is performed on the collected, scaled quantity data to produce a first set of metrics for the first group of semiconductor wafers. The first set of metrics including a first loads matrix and a first scores matrix.