公开(公告)号：EP1611599A4

公开(公告)日：2007-06-13

申请号：EP04719319

申请日：2004-03-10

Applicant: LAM RES CORP

Inventor： LOHOKARE SHRIKANT P ,  BAILEY ANDREW D III ,  HEMKER DAVID ,  COOK JOEL M

IPC: H01L21/321 ,  H01L21/3105 ,  H01L21/3213 ,  H01L21/768

CPC classification number: H01L21/32135 ,  H01L21/32115 ,  H01L21/32136 ,  H01L21/7684

Abstract: A system and method for planarizing a patterned semiconductor substrate includes receiving a patterned semiconductor substrate. The patterned semiconductor substrate having a conductive interconnect material filling multiple of features in the pattern. The conductive interconnect material having an overburden portion. The overburden portion includes a localized non-uniformity. An additional layer is formed an the overburden portion. The additional layer and the overburden portion are planarized. The planarizing process substantially entirely removes the additional layer.

公开(公告)号：EP1604393A4

公开(公告)日：2009-11-11

申请号：EP04719313

申请日：2004-03-10

Applicant: LAM RES CORP

Inventor： LOHOKARE SHRIKANT P ,  BAILEY ANDREW D III ,  HEMKER DAVID ,  COOK JOEL M

IPC: B44C1/22 ,  H01L20060101 ,  H01L21/302 ,  H01L21/304 ,  H01L21/311 ,  H01L21/321 ,  H01L21/3213 ,  H01L21/4763 ,  H01L21/768 ,  H01L33/00

CPC classification number: H01L21/7684 ,  H01L21/31116 ,  H01L21/32115 ,  H01L21/32135 ,  H01L21/32136

公开(公告)号：EP1632006A4

公开(公告)日：2008-11-26

申请号：EP04710690

申请日：2004-02-12

Applicant: LAM RES CORP

Inventor： WILCOXSON MARK H ,  BAILEY ANDREW D III

IPC: H01J7/24 ,  H01J37/32 ,  H01Q1/36 ,  H01Q7/00

CPC classification number: H01J37/32467 ,  H01J37/321 ,  H01Q1/36 ,  H01Q7/00

Abstract: An antenna arrangement (210) for generating an electric field inside a process chamber (202) through a window (212). Generally, the antenna arrangement (210) comprises an outer loop (610), comprising a first outer loop turn (618) disposed around an antenna axis (614), an inner loop (606), comprising a first inner loop turn (616) disposed around the antenna axis (614), wherein the inner loop (606) is closer to the antenna axis (614) than the outer loop (610) is to the antenna axis (614) in each azimuthal direction, and a radial connector (640) radially electrically connecting the outer loop (610) to the inner loop (606), wherein the radial connector (640) is placed a large distance from the window (212).

公开(公告)号：WO2012018448A3

公开(公告)日：2012-04-05

申请号：PCT/US2011041522

申请日：2011-06-22

Applicant: LAM RES CORP ,  DHINDSA RAJINDER ,  MARAKHATNOV ALEXEI ,  BAILEY ANDREW D III

Inventor： DHINDSA RAJINDER ,  MARAKHATNOV ALEXEI ,  BAILEY ANDREW D III

IPC: H01L21/205 ,  H01L21/3065

CPC classification number: H01L21/3065 ,  C23C16/4412 ,  C23C16/45565 ,  C23C16/45574 ,  C23C16/45576 ,  C23C16/50 ,  H01J37/32091 ,  H01J37/32449 ,  H01J37/32834 ,  H01L21/31

Abstract: An electrode is exposed to a plasma generation volume and is defined to transmit radiofrequency power to the plasma generation volume, and includes an upper surface for holding a substrate in exposure to the plasma generation volume. A gas distribution unit is disposed above the plasma generation volume and in a substantially parallel orientation to the electrode. The gas distribution unit includes an arrangement of gas supply ports for directing an input flow of a plasma process gas into the plasma generation volume in a direction substantially perpendicular to the upper surface of the electrode. The gas distribution unit also includes an arrangement of through-holes that each extend through the gas distribution unit to fluidly connect the plasma generation volume to an exhaust region. Each of the through-holes directs an exhaust flow from the plasma generation volume in a direction substantially perpendicular to the upper surface of the electrode.

Abstract translation: 电极暴露于等离子体产生体积并且被限定为将射频功率传输至等离子体产生体积，并且包括用于保持暴露于等离子体产生体积的基板的上表面。 气体分配单元设置在等离子体产生容积上方并且与电极基本平行地定向。 气体分配单元包括用于将等离子体处理气体的输入流在基本上垂直于电极的上表面的方向上引导到等离子体产生体积中的气体供给端口的布置。 气体分配单元还包括通孔布置，每个通孔延伸穿过气体分配单元以将等离子体生成体积流体连接到排气区域。 通孔中的每一个引导来自等离子体产生体积的排气流在基本上垂直于电极上表面的方向上。

公开(公告)号：WO2008042581A3

公开(公告)日：2008-10-09

申请号：PCT/US2007078578

申请日：2007-09-14

Applicant: LAM RES CORP ,  CHEN JACK ,  BAILEY ANDREW D III ,  MOORING BEN ,  CAIN STEPHEN J

Inventor： CHEN JACK ,  BAILEY ANDREW D III ,  MOORING BEN ,  CAIN STEPHEN J

IPC: G03B15/00 ,  B08B7/00 ,  B41B17/00 ,  G01B11/00 ,  G01B11/02 ,  G01N21/00 ,  G01R31/26 ,  G03B15/02 ,  G03B15/03

CPC classification number: H01L21/681 ,  H01L21/67259 ,  H01L21/67288

Abstract: A bevel inspection module for capturing images of a substrate is provided. The module includes a rotational motor, which is attached to a substrate chuck and is configured to rotate the substrate chuck thereby allowing the substrate to revolve. The module further includes a camera and an optic enclosure, which is attached to the camera and is configured to rotate, enabling light to be directed toward the substrate. The camera is mounted from a camera mount, which is configured to enable the camera to rotate on a 180 degree plane allowing the camera to capture images of at least one of a top view, a bottom view, and a side view of the substrate. The module yet also includes a backlight arrangement, which is configured to provide illumination to the substrate, thereby enabling the camera to capture the images, which shows contrast between the substrate and a background.

Abstract translation: 提供了用于捕获衬底图像的斜角检查模块。 该模块包括旋转马达，该旋转马达连接到衬底卡盘并且被配置为旋转衬底卡盘从而允许衬底旋转。 该模块还包括照相机和光学外壳，该照相机和光学外壳连接到照相机并且被配置成旋转，使得光被引导朝向基板。 照相机从照相机安装架安装，照相机安装架被配置成使照相机能够在180度平面上旋转，从而允许照相机捕获衬底的顶视图，底视图和侧视图中的至少一个的图像。 该模块还包括背光装置，该背光装置被配置为向基板提供照明，由此使得照相机能够捕捉图像，该图像示出了基板与背景之间的对比。

公开(公告)号：WO2006104842B1

公开(公告)日：2008-01-03

申请号：PCT/US2006010577

申请日：2006-03-24

Applicant: LAM RES CORP ,  BAILEY ANDREW D III

Inventor： BAILEY ANDREW D III

IPC: B25H1/00

CPC classification number: B25J5/00 ,  B08B1/00 ,  B08B9/00 ,  H01J37/32743 ,  H01J37/32862 ,  H01L21/67751 ,  Y10T29/49723

Abstract: A robot apparatus for executing a set of service procedures on a plasma processing system including a docking port is disclosed. The apparatus includes a platform and a docking probe coupled to the platform, wherein the docking probe is configured to dock with the docking port. The apparatus also includes a robot arm coupled to the platform, and further configured to substantially perform the set of service procedures, and a tool coupled to the robot arm. The apparatus further includes a computer coupled to the platform, wherein the computer is further configured to execute the set of service procedures, and wherein when the docking probe is docked to the docking port, the set of service procedures is performed by the tool.

Abstract translation: 公开了一种用于在包括对接端口的等离子体处理系统上执行一组服务程序的机器人装置。 该装置包括耦合到平台的平台和对接探针，其中对接探针配置成与对接端口对接。 该装置还包括联接到平台的机器人臂，并且还被配置为基本上执行该组服务程序，以及联接到机器人手臂的工具。 所述装置还包括耦合到所述平台的计算机，其中所述计算机还被配置为执行所述一组服务过程，并且其中当所述对接探针对接到所述对接端口时，所述一组服务过程由所述工具执行。

公开(公告)号：WO2004030084A3

公开(公告)日：2004-06-24

申请号：PCT/US0330610

申请日：2003-09-24

Applicant: LAM RES CORP ,  BAILEY ANDREW D III ,  YADAV PUNEET ,  MISRA PRATIK

Inventor： BAILEY ANDREW D III ,  YADAV PUNEET ,  MISRA PRATIK

IPC: H01L21/66

CPC classification number: H01L22/20

Abstract: A system and method of for determining multiple uniformity metrics of a semiconductor wafer manufacturing process includes collecting a quantity across each one of a group of semiconductor wafers. The collected quantity data is scaled and a principal component analysis (PCA) is performed on the collected, scaled quantity data to produce a first set of metrics for the first group of semiconductor wafers. The first set of metrics including a first loads matrix and a first scores matrix.

Abstract translation: 用于确定半导体晶片制造工艺的多个均匀性度量的系统和方法包括收集跨越一组半导体晶片中的每一个的数量。 收集的数量数据被缩放并且对收集的缩放量数据执行主成分分析（PCA）以产生用于第一组半导体晶片的第一组度量。 第一组度量包括第一加载矩阵和第一分数矩阵。

公开(公告)号：WO2007130630A3

公开(公告)日：2008-12-31

申请号：PCT/US2007010929

申请日：2007-05-04

Applicant: LAM RES CORP ,  YOON HYUNGSUK ALEXANDER ,  BAILEY ANDREW D III ,  JASON A RYDER ,  WILCOXSON MARK H ,  GASPARITSCH JEFFREY G ,  RANDY JOHNSON ,  HOFFMANN STEPHAN P

Inventor： YOON HYUNGSUK ALEXANDER ,  BAILEY ANDREW D III ,  JASON A RYDER ,  WILCOXSON MARK H ,  GASPARITSCH JEFFREY G ,  RANDY JOHNSON ,  HOFFMANN STEPHAN P

IPC: B08B11/02

CPC classification number: H01L21/67046 ,  Y10S134/902

Abstract: An apparatus, system and method for cleaning a substrate edge include a bristle brush unit that cleans bevel polymers deposited on substrate edges using frictional contact in the presence of cleaning chemistry. The bristle brush unit is made up of a plurality of outwardly extending vanes and is mounted on a rotating shaft. An abrasive material is distributed throughout and within the outwardly extending vanes of the bristle brush unit to provide the frictional contact. The bristle brush unit cleans the edge of the substrate by allowing frictional contact of the plurality of abrasive particles with the edge of the substrate in the presence of fluids, such as cleaning chemistry, to cut, rip and tear the bevel polymer from the edge of the substrate.

Abstract translation: 用于清洁基材边缘的装置，系统和方法包括刷毛刷单元，其在清洁化学品存在下使用摩擦接触来清洁沉积在基板边缘上的斜面聚合物。 刷毛单元由多个向外延伸的叶片组成，并安装在旋转轴上。 研磨材料分布在刷毛刷单元的向外延伸的叶片内部和内部，以提供摩擦接触。 刷毛刷单元通过在诸如清洁化学的流体存在下允许多个磨料颗粒与基材的边缘摩擦接触来清洁基材的边缘，以从斜面聚合物的边缘切割，撕裂和撕裂斜面聚合物 底物。

公开(公告)号：WO2007038580A3

公开(公告)日：2007-08-09

申请号：PCT/US2006037648

申请日：2006-09-26

Applicant: LAM RES CORP ,  KIM YUNSANG ,  BAILEY ANDREW D III

Inventor： KIM YUNSANG ,  BAILEY ANDREW D III

IPC: H01J37/32

CPC classification number: H01J37/32532 ,  H01J37/32357 ,  H01J37/3244 ,  H01J37/32862

Abstract: Improved mechanisms of removal of etch byproducts, dielectric films and metal films near the substrate bevel edge, and etch byproducts on substrate backside and chamber interior is provided to avoid the accumulation of polymer byproduct and deposited films and to improve process yield. An exemplary plasma etch processing chamber configured to clean a bevel edge of a substrate is provided. The chamber includes a bottom edge electrode surrounding a substrate support in the plasma processing chamber, wherein the substrate support is configured to receive the substrate and the bottom edge electrode and the substrate support are electrically isolated from each other by a bottom dielectric ring. The chamber also includes a top edge electrode surrounding a gas distribution plate opposing the substrate support, wherein the top edge electrode and the gas distribution plate are electrically isolated from each other by a top dielectric ring, and the top edge electrode and the bottom edge electrode are configured to generate a cleaning plasma to clean the bevel edge of the substrate.

Abstract translation: 提供了去除蚀刻副产物，电介质膜和金属薄膜附近基板斜边缘的改进机理，以及衬底背面和腔室内部的蚀刻副产物，以避免聚合物副产物和沉积膜的堆积并提高工艺产率。 提供了一种构造成清洁衬底的斜边缘的示例性等离子体蚀刻处理室。 所述腔室包括围绕所述等离子体处理室中的衬底支撑件的底部边缘电极，其中所述衬底支撑件构造成接收所述衬底，并且所述底部边缘电极和所述衬底支撑件通过底部电介质环彼此电隔离。 该室还包括围绕与衬底支撑件相对的气体分配板的顶部边缘电极，其中顶部边缘电极和气体分布板通过顶部介电环彼此电隔离，并且顶部边缘电极和底部边缘电极 被配置为产生清洁等离子体以清洁基板的斜边缘。

公开(公告)号：WO2007005211A3

公开(公告)日：2007-05-03

申请号：PCT/US2006023033

申请日：2006-06-13

Applicant: LAM RES CORP ,  BAILEY ANDREW D III

Inventor： BAILEY ANDREW D III

IPC: G01R35/00

CPC classification number: G01B7/105 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of determining a first thickness of a first conductive film formed of a first conductive material on a target substrate is disclosed. The method includes positioning a first eddy current sensor near a set of positions on the target substrate. The method also includes measuring, using the first eddy current sensor, a first set of electrical responses that includes at least one of a first voltage measurement and a first current measurement. The method further includes correcting the set of first electrical responses using a temperature-dependent compensation factor, thereby obtaining a corrected first set of electrical responses, the temperature-dependent compensation factor being obtained from a calibration substrate different from the target substrate, the calibration substrate having a second conductive film formed of a second conductive material that is substantially similar to the first conductive material of the target substrate; and determining the first thickness using the corrected first set of electrical responses.

Abstract translation: 公开了确定在目标基板上由第一导电材料形成的第一导电膜的第一厚度的方法。 该方法包括将第一涡流传感器定位在目标基板上的一组位置附近。 该方法还包括使用第一涡流传感器测量包括第一电压测量值和第一电流测量值中的至少一个的第一组电响应。 该方法还包括使用取决于温度的补偿因子来校正该组第一电响应，从而获得校正的第一组电响应，取决于温度的补偿因子是从与目标基板不同的校准基板获得的，校准基板 具有由与目标衬底的第一导电材料基本相似的第二导电材料形成的第二导电膜; 以及使用经校正的第一组电响应来确定第一厚度。