METHOD FOR QUANTIFYING UNIFORMITY PATTERNS AND INCLUSION OF EXPERT KNOWLEDGE FOR TOOL DEVELOPMENT AND CONTROL
    1.
    发明申请
    METHOD FOR QUANTIFYING UNIFORMITY PATTERNS AND INCLUSION OF EXPERT KNOWLEDGE FOR TOOL DEVELOPMENT AND CONTROL 审中-公开
    量化均匀性模式的方法和包含专家知识的工具开发和控制

    公开(公告)号:WO2004030084A3

    公开(公告)日:2004-06-24

    申请号:PCT/US0330610

    申请日:2003-09-24

    CPC classification number: H01L22/20

    Abstract: A system and method of for determining multiple uniformity metrics of a semiconductor wafer manufacturing process includes collecting a quantity across each one of a group of semiconductor wafers. The collected quantity data is scaled and a principal component analysis (PCA) is performed on the collected, scaled quantity data to produce a first set of metrics for the first group of semiconductor wafers. The first set of metrics including a first loads matrix and a first scores matrix.

    Abstract translation: 用于确定半导体晶片制造工艺的多个均匀性度量的系统和方法包括收集跨越一组半导体晶片中的每一个的数量。 收集的数量数据被缩放并且对收集的缩放量数据执行主成分分析(PCA)以产生用于第一组半导体晶片的第一组度量。 第一组度量包括第一加载矩阵和第一分数矩阵。

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