公开(公告)号：EP0999730A2

公开(公告)日：2000-05-10

申请号：EP99308389.8

申请日：1999-10-25

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Pilukaitis, Raymond W. ,  Shih, Yit. ,  Truong, Thang D. ,  Woods, William L.

IPC: H05K3/34

CPC classification number: H05K3/3463

Abstract: The present invention provides a method for soldering components to a printed wiring board. In one embodiment, the method comprises applying a substantially lead-free solder to the printed wiring board, placing an electronic component having lead-free terminals on the solder, and heating the printed wiring board in a substantially oxygen-free atmosphere to a temperature sufficient to reflow the solder. In an alternative embodiment, the method may further comprise applying a tin-based solder. In a particularly advantageous embodiment, the method includes applying a solder alloy of tin and a metal selected from the group consisting of: silver, antimony, copper, and gold.

Abstract translation: 本发明提供一种将部件焊接到印刷电路板的方法。 在一个实施例中，该方法包括向印刷电路板施加基本上无铅的焊料，将具有无铅端子的电子部件放置在焊料上，并将印刷电路板在基本上无氧的气氛中加热到足够的温度 以回流焊料。 在替代实施例中，该方法还可以包括施加锡基焊料。 在一个特别有利的实施例中，该方法包括应用锡和选自银，锑，铜和金的金属的焊料合金。

公开(公告)号：EP0999730A3

公开(公告)日：2001-12-05

申请号：EP99308389.8

申请日：1999-10-25

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Pilukaitis, Raymond W. ,  Shih, Yit. ,  Truong, Thang D. ,  Woods, William L.

IPC: H05K3/34 ,  B23K35/26

CPC classification number: H05K3/3463

Abstract: The present invention provides a method for soldering components to a printed wiring board. In one embodiment, the method comprises applying a substantially lead-free solder to the printed wiring board, placing an electronic component having lead-free terminals on the solder, and heating the printed wiring board in a substantially oxygen-free atmosphere to a temperature sufficient to reflow the solder. In an alternative embodiment, the method may further comprise applying a tin-based solder. In a particularly advantageous embodiment, the method includes applying a solder alloy of tin and a metal selected from the group consisting of: silver, antimony, copper, and gold.