公开(公告)号：EP0999730A2

公开(公告)日：2000-05-10

申请号：EP99308389.8

申请日：1999-10-25

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Pilukaitis, Raymond W. ,  Shih, Yit. ,  Truong, Thang D. ,  Woods, William L.

IPC: H05K3/34

CPC classification number: H05K3/3463

Abstract: The present invention provides a method for soldering components to a printed wiring board. In one embodiment, the method comprises applying a substantially lead-free solder to the printed wiring board, placing an electronic component having lead-free terminals on the solder, and heating the printed wiring board in a substantially oxygen-free atmosphere to a temperature sufficient to reflow the solder. In an alternative embodiment, the method may further comprise applying a tin-based solder. In a particularly advantageous embodiment, the method includes applying a solder alloy of tin and a metal selected from the group consisting of: silver, antimony, copper, and gold.

Abstract translation: 本发明提供一种将部件焊接到印刷电路板的方法。 在一个实施例中，该方法包括向印刷电路板施加基本上无铅的焊料，将具有无铅端子的电子部件放置在焊料上，并将印刷电路板在基本上无氧的气氛中加热到足够的温度 以回流焊料。 在替代实施例中，该方法还可以包括施加锡基焊料。 在一个特别有利的实施例中，该方法包括应用锡和选自银，锑，铜和金的金属的焊料合金。

公开(公告)号：EP1121007A2

公开(公告)日：2001-08-01

申请号：EP01300291.0

申请日：2001-01-15

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Chen, Shiaw-Jong Steve ,  Hooey, Roger J. ,  Truong, Thang D.

IPC: H05K3/44

CPC classification number: H05K3/445 ,  H05K3/403 ,  H05K3/4608 ,  H05K2201/10386

Abstract: An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement comprises a metal substrate (22) having a first side (24) and a second side (26), a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum (32) alternated with at least one first-side dielectric stratum (28) affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum (34) alternated with at least one second-side dielectric stratum (30) affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses (46, 48) intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.

Abstract translation: 一种被配置用于将电子部件安装在电路装置中的改进的电路板装置包括具有第一侧面（24）和第二侧面（26），第一侧面层状结构和第二侧面层状结构的金属基板（22）。 第一侧层状结构包括至少一个与固定在第一侧上的至少一个第一侧介电层（28）交替的第一侧导电层（32）。第二侧层流结构包括至少一个第二侧导电层 层（34）与固定在金属基板的第二侧的至少一个第二侧电介质层（30）交替。 所述装置还包括位于所述至少一个第一侧导电层的所选择的第一侧层和所述至少一个第二侧导电层的选定的第二侧层之间的多个导电的内侧平台（46,48）。

公开(公告)号：EP1043920A2

公开(公告)日：2000-10-11

申请号：EP00302525.1

申请日：2000-03-28

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Heinrich, Randy Thomas ,  Rozman, Allen Frank ,  Truong, Thang D. ,  Woods, William Lonzo, Jr.

IPC: H05K3/34 ,  H05K1/16

CPC classification number: H05K1/165 ,  H05K1/141 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10234 ,  H05K2201/10257 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/0455 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49126

Abstract: A surface mountable power supply and a method of manufacturing the power supply. In one embodiment, the power supply includes: (1) a substrate having opposing upper and lower conductive layers (2) a lower electrical component having a first lead mounted on a first pad on the lower conductive layer and subject to forces capable of detaching the lower electrical component from the substrate when the power supply passes through a reflow soldering process, (3) an upper electrical component having a second lead mounted on a second pad on the upper conductive layer, (4) a solder located proximate the first lead, the lower electrical component of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the lower electrical component in contact with the lower conductive layer as the power supply passes through the reflow soldering process, (5) a planar magnetic device mounted on the substrate, the planar magnetic device having windings formed from a portion of conductive traces on the upper and lower conductive layers and a core disposed through apertures of the substrate and proximate the windings and (6) an inter-substrate conductive mount, coupled to the lower conductive layer, composed of a material having a melting point above a solder reflow temperature and adapted to mount the power supply to an adjacent substrate and provide a conductive path therebetween, the conductive mount including first and second compliant solder joints at interfaces of the substrate and the adjacent substrate, respectively.

Abstract translation: 一种可表面安装的电源及其制造方法。 在一个实施例中，电源包括：（1）具有相对的上和下导电层（2）的衬底，下电气部件具有安装在下导电层上的第一焊盘上的第一引线，并受到能够分离 当电源通过回流焊接工艺时，从基板上降低电气部件，（3）上部电气部件，其具有安装在上部导电层上的第二焊盘上的第二引线，（4）位于第一引线附近的焊料， 所述较低的电气部件具有足够低的重量，使得当电源通过回流焊接工艺时，焊料的液态的表面张力足以保持较低的电气部件与下导电层接触;（5） 安装在基板上的平面磁性装置，所述平面磁性装置具有由上和下导电层上的一部分导电迹线形成的绕组 以及通过所述衬底的孔并且靠近所述绕组设置的芯体，以及（6）衬底间导电安装件，其耦合到所述下导电层，所述衬底的导电层由熔点高于焊料回流温度的材料组成，并且适于安装所述功率 供应到相邻基板并在其间提供导电路径，导电安装座分别包括在基板和相邻基板的界面处的第一和第二柔性焊接点。

公开(公告)号：EP1121007A3

公开(公告)日：2003-05-14

申请号：EP01300291.0

申请日：2001-01-15

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Chen, Shiaw-Jong Steve ,  Hooey, Roger J. ,  Truong, Thang D.

IPC: H05K3/44

CPC classification number: H05K3/445 ,  H05K3/403 ,  H05K3/4608 ,  H05K2201/10386

Abstract: An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement comprises a metal substrate (22) having a first side (24) and a second side (26), a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum (32) alternated with at least one first-side dielectric stratum (28) affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum (34) alternated with at least one second-side dielectric stratum (30) affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses (46, 48) intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.

公开(公告)号：EP0999730A3

公开(公告)日：2001-12-05

申请号：EP99308389.8

申请日：1999-10-25

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Pilukaitis, Raymond W. ,  Shih, Yit. ,  Truong, Thang D. ,  Woods, William L.

IPC: H05K3/34 ,  B23K35/26

CPC classification number: H05K3/3463

Abstract: The present invention provides a method for soldering components to a printed wiring board. In one embodiment, the method comprises applying a substantially lead-free solder to the printed wiring board, placing an electronic component having lead-free terminals on the solder, and heating the printed wiring board in a substantially oxygen-free atmosphere to a temperature sufficient to reflow the solder. In an alternative embodiment, the method may further comprise applying a tin-based solder. In a particularly advantageous embodiment, the method includes applying a solder alloy of tin and a metal selected from the group consisting of: silver, antimony, copper, and gold.