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1.发明公开Process for manufacturing micromechanical and microoptomechanical structures with backside metalization 有权一种用于制备具有背侧金属化的微机械和microoptomechanical结构过程
公开(公告)号：EP1211219A3
公开(公告)日：2004-06-16
申请号：EP01128160.7
申请日：2001-11-27
Applicant: MICROSCAN SYSTEMS INCORPORATED , XEROX CORPORATION
Inventor： Scharf, Bruce R. , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T. , Zosel, Andrew J. , Gulvin, Peter M. , Chen, Jingkuang
IPC: B81B3/00
CPC classification number: B81C1/00484 , B81B2201/042 , B81B2203/0118 , B81C1/00666 , B81C2201/0142
Abstract: The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.
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2.发明公开A micro-opto-electro-mechanical system (MOEMS) comprising reflective Fresnel zone plates 审中-公开微光机电系统（MOEMS）具有反射菲涅耳带片
公开(公告)号：EP1316835A3
公开(公告)日：2003-08-06
申请号：EP02258177.1
申请日：2002-11-27
Applicant: MICROSCAN SYSTEMS INCORPORATED
Inventor： Scharf, Bruce R. , Daiber, Troy D.
CPC classification number: G02B26/0816 , G02B5/18 , G02B6/352 , G02B6/358 , G02B6/3584 , G02B26/0808
Abstract: The present application discloses a micro-opto-electromechanical apparatus comprising a silicon wafer comprising a plurality of layers, a reflector formed in one of the plurality of layers, and a pattern on the reflector to focus or collimate an incident beam of radiation into a reflected beam.
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3.发明公开Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning 有权一种制备具有所施加的图案的微机械和microoptomechanical结构过程
公开(公告)号：EP1213260A2
公开(公告)日：2002-06-12
申请号：EP01128169.8
申请日：2001-11-27
Applicant: MICROSCAN SYSTEMS INCORPORATED , XEROX CORPORATION
Inventor： Scharf, Bruce R. , Gulvin, Peter M. , Chen, Jingkuang , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T.
IPC: B81B3/00
CPC classification number: B81C1/00666 , B81B2201/047 , B81B2203/0118
Abstract: The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a pattern on a single crystal silicon layer separated by an insulator layer from a substrate layer; defining a structure in the single-crystal silicon layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; and releasing the formed structure.
Abstract translation: 本发明提供了一种微机械或微光学机械结构。 该结构是由一种方法，包括限定通过从层基底绝缘层上分离的单晶硅层上的图案产生的; 限定在单晶硅层的结构; 沉积和在单晶硅层上蚀刻多晶硅层，与其余polysilcon形成该结构的机械或光学元件; 和释放所形成的结构。
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Patent Agency Ranking4.发明公开Process for manufacturing micromechanical and microoptomechanical structures with backside metalization 有权一种用于制备具有背侧金属化的微机械和microoptomechanical结构过程
公开(公告)号：EP1211219A2
公开(公告)日：2002-06-05
申请号：EP01128160.7
申请日：2001-11-27
Applicant: MICROSCAN SYSTEMS INCORPORATED , XEROX CORPORATION
Inventor： Scharf, Bruce R. , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T. , Zosel, Andrew J. , Gulvin, Peter M. , Chen, Jingkuang
IPC: B81B3/00
CPC classification number: B81C1/00484 , B81B2201/042 , B81B2203/0118 , B81C1/00666 , B81C2201/0142
Abstract: The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.
Abstract translation: 本发明提供了通过包括限定在通过从基材层绝缘层上分离的单晶硅层的结构的方法制造的微机械或微光机械结构; 选择性地蚀刻所述单晶硅层; 沉积和绝缘体层上蚀刻的多晶硅层，用剩余的多晶硅形成该结构的机械元件; 金属化结构的背面; 和释放所形成的结构。
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5.发明授权Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning 有权一种制备具有所施加的图案的微机械和microoptomechanical结构过程
公开(公告)号：EP1213260B1
公开(公告)日：2007-05-16
申请号：EP01128169.8
申请日：2001-11-27
Applicant: MICROSCAN SYSTEMS INCORPORATED , Xerox Corporation
Inventor： Scharf, Bruce R. , Gulvin, Peter M. , Chen, Jingkuang , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T.
IPC: B81B3/00
CPC classification number: B81C1/00666 , B81B2201/047 , B81B2203/0118
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6.发明授权Process for manufacturing micromechanical and microoptomechanical structures with backside metalization 有权一种用于制备具有背侧金属化的微机械和microoptomechanical结构过程
公开(公告)号：EP1211219B1
公开(公告)日：2007-05-16
申请号：EP01128160.7
申请日：2001-11-27
Applicant: MICROSCAN SYSTEMS INCORPORATED , Xerox Corporation
Inventor： Scharf, Bruce R. , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T. , Zosel, Andrew J. , Gulvin, Peter M. , Chen, Jingkuang
IPC: B81B3/00
CPC classification number: B81C1/00484 , B81B2201/042 , B81B2203/0118 , B81C1/00666 , B81C2201/0142
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7.发明公开Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning 有权一种用于制备具有附接的样品的微机械和microoptomechanical结构过程
公开(公告)号：EP1213260A3
公开(公告)日：2004-06-16
申请号：EP01128169.8
申请日：2001-11-27
Applicant: MICROSCAN SYSTEMS INCORPORATED , XEROX CORPORATION
Inventor： Scharf, Bruce R. , Gulvin, Peter M. , Chen, Jingkuang , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T.
IPC: B81B3/00
CPC classification number: B81C1/00666 , B81B2201/047 , B81B2203/0118
Abstract: The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a pattern on a single crystal silicon layer separated by an insulator layer from a substrate layer; defining a structure in the single-crystal silicon layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; and releasing the formed structure.
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8.发明公开A micro-opto-electro-mechanical system (MOEMS) comprising reflective Fresnel zone plates 审中-公开Mikrooptoelektromechanise系统（MOEMS）mit reflektierenden Fresnelschen Zonenplatten
公开(公告)号：EP1316835A2
公开(公告)日：2003-06-04
申请号：EP02258177.1
申请日：2002-11-27
Applicant: MICROSCAN SYSTEMS INCORPORATED
Inventor： Scharf, Bruce R. , Daiber, Troy D.
CPC classification number: G02B26/0816 , G02B5/18 , G02B6/352 , G02B6/358 , G02B6/3584 , G02B26/0808
Abstract: The present application discloses a micro-opto-electromechanical apparatus comprising a silicon wafer comprising a plurality of layers, a reflector formed in one of the plurality of layers, and a pattern on the reflector to focus or collimate an incident beam of radiation into a reflected beam.
Abstract translation: 本申请公开了一种微光学机电装置，其包括包括多个层的硅晶片，形成在多个层中的一个层中的反射器，以及反射器上的图案，以将入射入射的光束聚焦或准直成反射 光束。
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