公开(公告)号：US20180061520A1

公开(公告)日：2018-03-01

申请号：US15555319

申请日：2016-02-29

Applicant: NAMICS CORPORATION

Inventor： Masashi KAJITA ,  Takashi SAKAMOTO ,  Shigeko KONNO ,  Tomoyuki TAKAHASHI

IPC: H01B1/22 ,  H01B5/14 ,  H01B13/00

CPC classification number: H01B1/22 ,  H01B5/14 ,  H01B13/0036 ,  H01L24/00 ,  H05K3/321

Abstract: The purpose of the present invention is to provide a conductive copper paste which is curable in an ambient atmosphere, has a long pot life, and, has a low specific resistance even under a high-temperature and short-time curing condition, wherein the specific resistance after curing does not greatly vary depending on a copper powder content. The conductive copper paste provided is characterized by containing (A) a copper powder, (B) a thermosetting resin, (C) a fatty acid that is liquid at normal temperature, and (D) triethanolamine. Preferably, component (B) is a resol-type phenol resin. More preferably, the content of component (B) is 10 to 20 parts by mass with respect to a total of 100 parts by mass of component (A) and component (B).