公开(公告)号：US20200266170A1

公开(公告)日：2020-08-20

申请号：US16067873

申请日：2017-01-11

Applicant: NAMICS CORPORATION

Inventor： Tomoyuki TAKAHASHI

IPC: H01L23/00 ,  C08K3/08 ,  C08K5/09 ,  C08K5/17 ,  C08K13/02 ,  H01B1/22

Abstract: An object of the present invention is to provide: a resin composition in which the specific resistance after curing is low regardless of the type of a thermosetting resin, and furthermore, the specific resistance after curing does not significantly change depending on the content of a copper powder; and a conductive copper paste including the resin composition. There are provided a resin composition including (A) a copper powder having an oxygen content of 0.3% by mass or less, (B) a thermosetting resin, (C) a fatty acid, and (D) an amine or an amine compound, as well as a conductive copper paste containing the resin composition. The (A) component has an average particle size of preferably 1 to 10 μm.

公开(公告)号：US20150190865A1

公开(公告)日：2015-07-09

申请号：US14644579

申请日：2015-03-11

Applicant: NAMICS CORPORATION

Inventor： Tomoyuki TAKAHASHI ,  Akito YOSHII

IPC: B22F9/24 ,  C22C5/04 ,  C22C5/02 ,  C22C19/03 ,  C22C5/06 ,  C22C9/00

CPC classification number: B22F9/24 ,  B22F1/0011 ,  B22F1/0014 ,  B22F3/11 ,  B22F9/18 ,  C22C1/02 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06 ,  C22C9/00 ,  C22C19/03 ,  H01B1/02 ,  H01B1/22 ,  Y10T428/12

Abstract: A method for producing a metal particle which includes the steps of: mixing a metal salt and a polycarboxylic acid in a liquid phase; adding a reducing agent to the resultant mixture to deposit metal particles; and drying the deposited metal particles.

Abstract translation: 一种金属粒子的制造方法，其特征在于，包括以下步骤：将液态金属盐和多元羧酸混合; 向所得混合物中加入还原剂以沉积金属颗粒; 并干燥沉积的金属颗粒。

公开(公告)号：US20200062926A1

公开(公告)日：2020-02-27

申请号：US16346673

申请日：2017-11-02

Applicant: NAMICS CORPORATION

Inventor： Tomoyuki TAKAHASHI

IPC: C08K9/02 ,  C01G23/04 ,  C08L101/00 ,  H01B1/20

Abstract: Obtained are metal-coated particles able to be used in a resin composition capable of forming the wiring of an electrical circuit and/or electronic circuit having a low possibility of disconnection. The metal-coated particles have a metal coating layer on the surface of titanium oxide, wherein the titanium oxide has a columnar shape having a particle length and a particle diameter and the particle length of the titanium oxide is longer than the particle diameter, and the metal-coated particles have a columnar shape having a particle length and a particle diameter and the particle length of the metal-coated particles is longer than the particle diameter.

公开(公告)号：US20180233248A1

公开(公告)日：2018-08-16

申请号：US15750866

申请日：2016-07-27

Applicant: NAMICS CORPORATION

Inventor： Tomoyuki TAKAHASHI

IPC: H01B1/22 ,  H01L23/00 ,  C09J9/02 ,  C09J161/06

CPC classification number: H01B1/22 ,  C09J9/02 ,  C09J161/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/83851 ,  H05K1/095

Abstract: An object of the present invention is to provide a resin composition suitable for copper pastes, which can be cured in an ambient atmosphere and has a viscosity within an appropriate range and a low specific resistance after curing. This resin composition includes (A) a copper powder, (B) a thermosetting resin, (C) a fatty acid, (D) an amine, and (E) 4-aminosalicylic acid. Preferably, the (B) component is resol-type phenolic resin. More preferably, the (C) component is at least one selected from oleic acid, linoleic acid, linolenic acid, stearic acid, palmitic acid, lauric acid, butyric acid, and propionic acid.

公开(公告)号：US20210040344A1

公开(公告)日：2021-02-11

申请号：US16968179

申请日：2019-01-16

Applicant: NAMICS CORPORATION

Inventor： Tomoyuki TAKAHASHI

IPC: C09D11/52 ,  C09D11/037 ,  H05K1/09 ,  A41D31/04 ,  C09D11/102 ,  H01B1/22

Abstract: An electrically conductive paste contains (A) metal-coated particles each composed of titanium oxide and a metal coating layer formed on the surface of the titanium oxide and (B) a resin. The titanium oxide has a columnar form having a particle length and a particle shorter diameter and the particle length of the titanium oxide is longer than the particle shorter diameter. Each of the metal-coated particles has a columnar form having a particle length and a particle shorter diameter and the particle length of each of the metal-coated particles is longer than the particle shorter diameter.

公开(公告)号：US20180061520A1

公开(公告)日：2018-03-01

申请号：US15555319

申请日：2016-02-29

Applicant: NAMICS CORPORATION

Inventor： Masashi KAJITA ,  Takashi SAKAMOTO ,  Shigeko KONNO ,  Tomoyuki TAKAHASHI

IPC: H01B1/22 ,  H01B5/14 ,  H01B13/00

CPC classification number: H01B1/22 ,  H01B5/14 ,  H01B13/0036 ,  H01L24/00 ,  H05K3/321

Abstract: The purpose of the present invention is to provide a conductive copper paste which is curable in an ambient atmosphere, has a long pot life, and, has a low specific resistance even under a high-temperature and short-time curing condition, wherein the specific resistance after curing does not greatly vary depending on a copper powder content. The conductive copper paste provided is characterized by containing (A) a copper powder, (B) a thermosetting resin, (C) a fatty acid that is liquid at normal temperature, and (D) triethanolamine. Preferably, component (B) is a resol-type phenol resin. More preferably, the content of component (B) is 10 to 20 parts by mass with respect to a total of 100 parts by mass of component (A) and component (B).