公开(公告)号：US20190338138A1

公开(公告)日：2019-11-07

申请号：US16474586

申请日：2017-11-28

Applicant: NAMICS Corporation

Inventor： Ayako SATO ,  Masashi KAJITA

IPC: C09C1/30 ,  C01B33/18 ,  C09J11/04 ,  C09J7/30 ,  H01L23/29

Abstract: The present invention provides a surface-treated silica filler for suppressing an increase in viscosity when added to a resin composition used for applications such as a semiconductor sealing material, and the resin composition containing the surface-treated silica filler. The surface-treated silica filler of the present invention is surface-treated with a basic substance having an acid dissociation constant (pKa) of its conjugate acid of 9.4 or more.

公开(公告)号：US20200283599A1

公开(公告)日：2020-09-10

申请号：US16764646

申请日：2018-12-12

Applicant: NAMICS CORPORATION

Inventor： Masashi KAJITA ,  Ayako SATO

IPC: C08K9/06 ,  C08K3/36 ,  C08K5/5435 ,  C08K5/5425 ,  C08K5/17 ,  C09J7/30 ,  C09J11/06 ,  C09J163/00 ,  C09C1/30 ,  H01L23/29

Abstract: To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

公开(公告)号：US20180061520A1

公开(公告)日：2018-03-01

申请号：US15555319

申请日：2016-02-29

Applicant: NAMICS CORPORATION

Inventor： Masashi KAJITA ,  Takashi SAKAMOTO ,  Shigeko KONNO ,  Tomoyuki TAKAHASHI

IPC: H01B1/22 ,  H01B5/14 ,  H01B13/00

CPC classification number: H01B1/22 ,  H01B5/14 ,  H01B13/0036 ,  H01L24/00 ,  H05K3/321

Abstract: The purpose of the present invention is to provide a conductive copper paste which is curable in an ambient atmosphere, has a long pot life, and, has a low specific resistance even under a high-temperature and short-time curing condition, wherein the specific resistance after curing does not greatly vary depending on a copper powder content. The conductive copper paste provided is characterized by containing (A) a copper powder, (B) a thermosetting resin, (C) a fatty acid that is liquid at normal temperature, and (D) triethanolamine. Preferably, component (B) is a resol-type phenol resin. More preferably, the content of component (B) is 10 to 20 parts by mass with respect to a total of 100 parts by mass of component (A) and component (B).