公开(公告)号：WO2003019999A1

公开(公告)日：2003-03-06

申请号：PCT/US2002/026370

申请日：2002-08-16

Applicant: RAYTHEON COMPANY

Inventor： DEARDEN, Timothy E. ,  STITT, Jeffrey J. ,  QUAN, Clifton

IPC: H05K1/18

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/306 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10348 ,  H05K2201/10371 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2203/1147

Abstract: An RF interconnect is incorporated in RF module packages (50) for direct attachment onto a multi-layer PWB (100) using compressible center conductor (fuzz button) interconnects. The module has circuitry operating at microwave frequencies. The module package includes a metal housing (52) including a metal bottom wall structure (54). The module includes a plurality of RF interconnects, which provide RF interconnection between the package (50) and the PWB (100). Each interconnect includes a feedthrough center pin (72) protruding through an opening formed in the metal bottom wall, with isolation provided by a dielectric feedthrough insulator (74). The center pin is surrounded with a ring of shield pins (76) attached to the external surface of the bottom wall of the module housing. The pins are insertable in holes (116a, 116b) formed in the PWB (100), and make contact with fuzz button interconnects (130, 132) disposed in the holes (116a, 116b). Circuitry (148, 150) connects the fuzz button interconnects (130, 132) to appropriate levels (120, 122, 124) of the PWB signal conduction.

Abstract translation: RF互连结合在RF模块封装（50）中，用于使用可压缩中心导体（模糊按钮）互连直接连接到多层PWB（100）上。 该模块具有以微波频率工作的电路。 模块封装包括包括金属底壁结构（54）的金属外壳（52）。 该模块包括多个RF互连，其在封装（50）和PWB（100）之间提供RF互连。 每个互连包括通过形成在金属底壁中的开口突出的馈通中心销（72），隔离由绝缘馈通绝缘体（74）提供。 中心销被围绕着安装在模块外壳底壁外表面上的一个屏蔽销（76）环。 销可插入形成在PWB（100）中的孔（116a，116b）中，并与布置在孔（116a，116b）中的绒毛按钮互连（130,132）接触。 电路（148,150）将毛绒按钮互连（130,132）连接到PWB信号传导的适当电平（120,122,124）。