中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

33 records (took 0.037 seconds)

    Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards
    3.
    发明授权
    Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards 失效
    低成本，大规模RF混合封装，可以简单的组装到混合信号印刷电路板上

    公开(公告)号：US06417747B1

    公开(公告)日：2002-07-09

    申请号：US09935496

    申请日：2001-08-23

    Applicant: Timothy E. Dearden ,  Jeffrey J. Stitt ,  Clifton Quan

    Inventor： Timothy E. Dearden ,  Jeffrey J. Stitt ,  Clifton Quan

    IPC: H01P100

    CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/306 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10348 ,  H05K2201/10371 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2203/1147

    Abstract: An RF interconnect is incorporated in RF module packages for direct attachment onto a multi-layer PWB using compressible center conductor (fuzz button) interconnects. The module has circuitry operating at microwave frequencies. The module package includes a metal housing including a metal bottom wall structure. The module includes a plurality of RF interconnects, which provide RF interconnection between the package and the PWB. Each interconnect includes a feedthrough center pin protruding through an opening formed in the metal bottom wall, with isolation provided by a dielectric feedthrough insulator. The center pin is surrounded with a ring of shield pins attached to the external surface of the bottom wall of the module housing. The pins are insertable in holes formed in the PWB, and make contact with fuzz button interconnects disposed in the holes. Circuitry connects the fuzz button interconnects to appropriate levels of the PWB for grounding and RF signal conduction.

    Abstract translation: RF互连结合在RF模块封装中，以使用可压缩中心导体（Fuzz按钮）互连直接连接到多层PWB上。 该模块具有以微波频率工作的电路。 模块封装包括金属外壳，其包括金属底壁结构。 该模块包括多个RF互连，其在封装和PWB之间提供RF互连。 每个互连件包括穿过形成在金属底壁中的开口突出的馈通中心销，由隔离绝缘子提供隔离。 中心销被围绕着一个安装在模块壳体底壁外表面的屏蔽销圈。 销可插入形成在PWB中的孔中，并与布置在孔中的绒头按钮互连接触。 电路将毛绒按钮互连连接到PWB的适当级别，用于接地和RF信号传导。

    LOW COST, LARGE SCALE RF HYBRID PACKAGE FOR SIMPLE ASSEMBLY ONTO MIXED SIGNAL PRINTED WIRING BOARDS
    8.
    发明申请
    LOW COST, LARGE SCALE RF HYBRID PACKAGE FOR SIMPLE ASSEMBLY ONTO MIXED SIGNAL PRINTED WIRING BOARDS 审中-公开
    低成本，大规模射频混合包装，用于简单组装到混合信号打印布线

    公开(公告)号：WO2003019999A1

    公开(公告)日：2003-03-06

    申请号：PCT/US2002/026370

    申请日：2002-08-16

    Applicant: RAYTHEON COMPANY

    Inventor： DEARDEN, Timothy E. ,  STITT, Jeffrey J. ,  QUAN, Clifton

    IPC: H05K1/18

    CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/306 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10348 ,  H05K2201/10371 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2203/1147

    Abstract: An RF interconnect is incorporated in RF module packages (50) for direct attachment onto a multi-layer PWB (100) using compressible center conductor (fuzz button) interconnects. The module has circuitry operating at microwave frequencies. The module package includes a metal housing (52) including a metal bottom wall structure (54). The module includes a plurality of RF interconnects, which provide RF interconnection between the package (50) and the PWB (100). Each interconnect includes a feedthrough center pin (72) protruding through an opening formed in the metal bottom wall, with isolation provided by a dielectric feedthrough insulator (74). The center pin is surrounded with a ring of shield pins (76) attached to the external surface of the bottom wall of the module housing. The pins are insertable in holes (116a, 116b) formed in the PWB (100), and make contact with fuzz button interconnects (130, 132) disposed in the holes (116a, 116b). Circuitry (148, 150) connects the fuzz button interconnects (130, 132) to appropriate levels (120, 122, 124) of the PWB signal conduction.

    Abstract translation: RF互连结合在RF模块封装（50）中，用于使用可压缩中心导体（模糊按钮）互连直接连接到多层PWB（100）上。 该模块具有以微波频率工作的电路。 模块封装包括包括金属底壁结构（54）的金属外壳（52）。 该模块包括多个RF互连，其在封装（50）和PWB（100）之间提供RF互连。 每个互连包括通过形成在金属底壁中的开口突出的馈通中心销（72），隔离由绝缘馈通绝缘体（74）提供。 中心销被围绕着安装在模块外壳底壁外表面上的一个屏蔽销（76）环。 销可插入形成在PWB（100）中的孔（116a，116b）中，并与布置在孔（116a，116b）中的绒毛按钮互连（130,132）接触。 电路（148,150）将毛绒按钮互连（130,132）连接到PWB信号传导的适当电平（120,122,124）。

    TESTING OF INTERCONNECTIONS BETWEEN STACKED CIRCUIT BOARDS
    9.
    发明申请
    TESTING OF INTERCONNECTIONS BETWEEN STACKED CIRCUIT BOARDS 审中-公开
    堆叠电路板之间的互连测试

    公开(公告)号：WO2005004566A1

    公开(公告)日：2005-01-13

    申请号：PCT/SE2003/001183

    申请日：2003-07-07

    Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (publ) ,  NILSSON, Mattias ,  JOHANSSON, Stefan

    Inventor： NILSSON, Mattias ,  JOHANSSON, Stefan

    IPC: H05K3/36

    CPC classification number: H05K3/368 ,  G01R31/046 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/325 ,  H05K3/4614 ,  H05K2201/10348 ,  H05K2201/10378 ,  H05K2203/162

    Abstract: A retainer board (25, 27, 28) having at least one hole (10) in which a wire button contact (5) is inserted, wherein the hole (10) is plated and at least one conductor (20) is connected to the plated hole for providing outside access. Moreover a method for testing stacked circuit boards are disclosed comprising the steps of detachably arranging at least two circuits boards (11, 12, 29), testing the individual functionality of the circuit boards (11, 12) and if approved, assembling the circuit boards (11, 12) and the first retainer board (25, 27, 28), and asserting whether the overall functionality of the arrangement is approved.

    Abstract translation: 具有至少一个孔（10）的保持板（25,27,28），其中插入有电线按钮触点（5），其中所述孔（10）被电镀，并且至少一个导体（20）连接到 电镀孔用于提供外部接入。 此外，公开了一种用于测试堆叠电路板的方法，包括以下步骤：可拆卸地布置至少两个电路板（11,12,29），测试电路板（11,12）的各个功能，并且如果被批准，组装电路板 （11,12）和第一保持板（25,27,28），并且断言该装置的整体功能是否被批准。

Patent Agency Ranking