-
1.发明申请
公开(公告)号：WO2021167711A1
公开(公告)日：2021-08-26
申请号：PCT/US2021/012773
申请日：2021-01-08
Applicant: RAYTHEON COMPANY
Inventor： MCCORDIC, Craig H. , ELLSWORTH, Joseph R. , SOUTHARD, Todd E. , HEINRICH, Ethan S. , ZARKH, Dimitry
IPC: H05K7/20 , H01L23/373
Abstract: An apparatus includes a coldplate (104, 200, 300) configured to be thermally coupled to a structure (100) to be cooled and to remove thermal energy from the structure. The coldplate includes (i) first and second outer layers (202 and 206, 302 and 306) having at least one first material and (ii) a third layer (204, 304) embedded in the outer layers and having at least one second material. The first and second materials have different coefficients of thermal expansion (CTEs). The third layer is embedded non-uniformly in the outer layers so that different zones (114a-114c, 212a-212c, 312a-312c) of the coldplate have different local CTEs. The third layer may include openings (210, 310) extending through the second material(s), and projections (208, 308) of the first material(s) from at least one of the first and second outer layers may partially or completely fill the openings. The first and second outer layers may include aluminum or an aluminum alloy, and the third layer may include aluminum silicon carbide or thermal pyrolytic graphite.
-
公开(公告)号：WO2020040853A1
公开(公告)日：2020-02-27
申请号：PCT/US2019/037775
申请日：2019-06-18
Applicant: RAYTHEON COMPANY
Inventor： WELLS, Derek B. , WALSH JR., Kenneth P. , RENAUD, Gregory S. , ZARKH, Dimitry
IPC: H01G11/82 , H01G11/10 , H01G2/04 , H01G11/86 , H01M2/02 , H01M2/04 , H01M2/10 , H01M10/0587 , H01G2/06 , H01G4/38 , H05K5/02 , H01G2/10 , H01G11/80 , H01G4/40
Abstract: A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component of an electronics assembly, and a radial retention component supported about an inner surface of the opening of the collar body. The radial retention component is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board. Associated systems and methods are provided.
-
公开(公告)号：WO2019022922A1
公开(公告)日：2019-01-31
申请号：PCT/US2018/040549
申请日：2018-07-02
Applicant: RAYTHEON COMPANY
Inventor： PUZELLA, Angelo, M. , AUER, Lance, A. , ARMENDARIZ, Norman , BOZZA, Donald, A. , FRANCIS, John, B. , HENAULT, Philip, M. , OBERLE, Randal, W. , TRULLI, Susan, C. , ZARKH, Dimitry
Abstract: A coaxial transmission line structure having a center conductor section having an input contact and an output contact the output contact being larger than the input contact, the center conductor having a plurality of different geometrically shaped, electrically conductive layers having sizes progressively increasing from the input contact to the larger output contact to conductor transition from the input contact to the larger output contact, the electrically conductive layers being electrically interconnected by staggered microvias passing through dielectric layers to the center; and (B) an outer conductor section disposed about, coaxial with, and electrically isolated from, the center conductor by the dielectric layers.
-
公开(公告)号：WO2016145268A1
公开(公告)日：2016-09-15
申请号：PCT/US2016/021904
申请日：2016-03-11
Applicant: RAYTHEON COMPANY
Inventor： MERCIER, Dennis W. , DELISLE, Corey R. , LOTT, Patrick J. , ZARKH, Dimitry
CPC classification number: H05K1/184 , F16M13/02 , H01G2/06 , H01G4/228 , H01G4/38 , H01G9/26 , H01G11/10 , H01G11/76 , H05K1/11 , H05K1/115 , H05K1/181 , H05K3/306 , H05K3/3447 , H05K2201/10015 , H05K2201/10431 , H05K2201/10606 , Y02E60/13
Abstract: A support apparatus for a component is provided and includes a periphery entirely disposable within a footprint of the component on a surface of a substrate, a first portion having a first surface adhesively connectable to the component, a second portion having a second surface disposable to contact the surface of the substrate in discrete sectors and defining an aperture through which leads are extendable from the component and through the substrate, and vents extending between the discrete sectors from the aperture to the periphery, and bosses disposed to protrude from the second surface and into through-holes defined in the substrate.
Abstract translation: 提供了一种用于部件的支撑装置，其包括在基板的表面上的部件的占地面积内的完全一次性的外围的第一部分，具有可与该部件粘合地连接的第一表面的第一部分，具有一次性接触的第二表面的第二部分 衬底的表面在离散的扇区中并且限定了一个孔，通过该孔，引线可以从部件和基板延伸出来，并且在从孔到周边的离散扇区之间延伸的通风口以及从第二表面突出设置的凸起 通孔限定在基板中。
-
公开(公告)号：WO2010111004A1
公开(公告)日：2010-09-30
申请号：PCT/US2010/026014
申请日：2010-03-03
Applicant: RAYTHEON COMPANY , CHEYNE, Scott R. , PAQUETTE, Jeffrey , WALKER, John D. , ZARKH, Dimitry
Inventor： CHEYNE, Scott R. , PAQUETTE, Jeffrey , WALKER, John D. , ZARKH, Dimitry
CPC classification number: H01R25/162 , H01R4/38
Abstract: In one aspect, a busbar connector includes first and second portions. Each portion includes a rigid member forming an exterior portion of the busbar connector, a conduction member forming an interior portion of the busbar connector and a compliant member having a stiffness less than the rigid member and including a first surface attached to the rigid member and a second surface opposite the first surface attached to the conduction member. The busbar connector also includes a fastener structure configured to secure a first busbar and a second busbar between and in contact with the conduction members of the first and second portions to allow current to flow between the first and second busbars.
Abstract translation: 一方面，母线连接器包括第一和第二部分。 每个部分包括形成母线连接器的外部部分的刚性构件，形成母线连接器的内部的导电构件和具有小于刚性构件的刚度的顺应构件，并且包括附接到刚性构件的第一表面和 与连接到导电构件的第一表面相对的第二表面。 母线连接器还包括紧固件结构，其被配置为将第一母线和第二母线固定在第一和第二部分的导电部件之间并与之接触，以允许电流在第一和第二母线之间流动。
-
Patent Agency Ranking6.发明公开
公开(公告)号：EP4108052A1
公开(公告)日：2022-12-28
申请号：EP21705676.1
申请日：2021-01-08
Applicant: Raytheon Company
Inventor： MCCORDIC, Craig H. , ELLSWORTH, Joseph R. , SOUTHARD, Todd E. , HEINRICH, Ethan S. , ZARKH, Dimitry
IPC: H05K7/20 , H01L23/373
-
公开(公告)号：EP2412065A1
公开(公告)日：2012-02-01
申请号：EP10708054.1
申请日：2010-03-03
Applicant: Raytheon Company
Inventor： CHEYNE, Scott R. , PAQUETTE, Jeffrey , WALKER, John D. , ZARKH, Dimitry
CPC classification number: H01R25/162 , H01R4/38
Abstract: In one aspect, a busbar connector includes first and second portions. Each portion includes a rigid member forming an exterior portion of the busbar connector, a conduction member forming an interior portion of the busbar connector and a compliant member having a stiffness less than the rigid member and including a first surface attached to the rigid member and a second surface opposite the first surface attached to the conduction member. The busbar connector also includes a fastener structure configured to secure a first busbar and a second busbar between and in contact with the conduction members of the first and second portions to allow current to flow between the first and second busbars.
-
公开(公告)号：EP3659206A1
公开(公告)日：2020-06-03
申请号：EP18746365.8
申请日：2018-07-02
Applicant: Raytheon Company
-
公开(公告)号：EP3269214A1
公开(公告)日：2018-01-17
申请号：EP16711948.6
申请日：2016-03-11
Applicant: Raytheon Company
Inventor： MERCIER, Dennis W. , DELISLE, Corey R. , LOTT, Patrick J. , ZARKH, Dimitry
CPC classification number: H05K1/184 , F16M13/02 , H01G2/06 , H01G4/228 , H01G4/38 , H01G9/26 , H01G11/10 , H01G11/76 , H05K1/11 , H05K1/115 , H05K1/181 , H05K3/306 , H05K3/3447 , H05K2201/10015 , H05K2201/10431 , H05K2201/10606 , Y02E60/13
Abstract: A support apparatus for a component is provided and includes a periphery entirely disposable within a footprint of the component on a surface of a substrate, a first portion having a first surface adhesively connectable to the component, a second portion having a second surface disposable to contact the surface of the substrate in discrete sectors and defining an aperture through which leads are extendable from the component and through the substrate, and vents extending between the discrete sectors from the aperture to the periphery, and bosses disposed to protrude from the second surface and into through-holes defined in the substrate.
-
公开(公告)号：EP4220673A3
公开(公告)日：2023-08-09
申请号：EP23162959.3
申请日：2019-06-18
Applicant: Raytheon Company
Inventor： WELLS, Derek B. , WALSH JR, Kenneth P. , RENAUD, Gregory S. , ZARKH, Dimitry
IPC: H01G11/82 , H01G11/10 , H01G2/04 , H01G11/86 , H01M10/0587 , H01G2/06 , H01G4/38 , H05K5/02 , H05K7/12 , H01G2/10 , H01G11/80 , H01G4/40
Abstract: A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component of an electronics assembly, and a radial retention component supported about an inner surface of the opening of the collar body. The radial retention component is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board. Associated systems and methods are provided.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.02 seconds)
