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Patent Agency Ranking
公开(公告)号：WO2016145268A1
公开(公告)日：2016-09-15
申请号：PCT/US2016/021904
申请日：2016-03-11
Applicant: RAYTHEON COMPANY
Inventor： MERCIER, Dennis W. , DELISLE, Corey R. , LOTT, Patrick J. , ZARKH, Dimitry
CPC classification number: H05K1/184 , F16M13/02 , H01G2/06 , H01G4/228 , H01G4/38 , H01G9/26 , H01G11/10 , H01G11/76 , H05K1/11 , H05K1/115 , H05K1/181 , H05K3/306 , H05K3/3447 , H05K2201/10015 , H05K2201/10431 , H05K2201/10606 , Y02E60/13
Abstract: A support apparatus for a component is provided and includes a periphery entirely disposable within a footprint of the component on a surface of a substrate, a first portion having a first surface adhesively connectable to the component, a second portion having a second surface disposable to contact the surface of the substrate in discrete sectors and defining an aperture through which leads are extendable from the component and through the substrate, and vents extending between the discrete sectors from the aperture to the periphery, and bosses disposed to protrude from the second surface and into through-holes defined in the substrate.
Abstract translation: 提供了一种用于部件的支撑装置，其包括在基板的表面上的部件的占地面积内的完全一次性的外围的第一部分，具有可与该部件粘合地连接的第一表面的第一部分，具有一次性接触的第二表面的第二部分 衬底的表面在离散的扇区中并且限定了一个孔，通过该孔，引线可以从部件和基板延伸出来，并且在从孔到周边的离散扇区之间延伸的通风口以及从第二表面突出设置的凸起 通孔限定在基板中。
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2.发明申请
公开(公告)号：WO2020112311A1
公开(公告)日：2020-06-04
申请号：PCT/US2019/059789
申请日：2019-11-05
Applicant: RAYTHEON COMPANY
Inventor： MARTINEZ, Sergio V. , OGORZALEK, Jeffrey R. , LOTT, Patrick J.
Abstract: A method (400) for depositing a material (106) to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area (102) of a substrate (100), a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool (200) to deposit the material in the deposition pattern that extends across the pad area of the substrate.
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3.发明公开
公开(公告)号：EP4216683A1
公开(公告)日：2023-07-26
申请号：EP23161444.7
申请日：2019-11-05
Applicant: Raytheon Company
Inventor： MARTINEZ, Sergio V. , OGORZALEK, Jeffrey R. , LOTT, Patrick J.
Abstract: A method (400) for depositing a material (106) to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area (102) of a substrate (100), a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool (200) to deposit the material in the deposition pattern that extends across the pad area of the substrate.
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公开(公告)号：EP3269214A1
公开(公告)日：2018-01-17
申请号：EP16711948.6
申请日：2016-03-11
Applicant: Raytheon Company
Inventor： MERCIER, Dennis W. , DELISLE, Corey R. , LOTT, Patrick J. , ZARKH, Dimitry
CPC classification number: H05K1/184 , F16M13/02 , H01G2/06 , H01G4/228 , H01G4/38 , H01G9/26 , H01G11/10 , H01G11/76 , H05K1/11 , H05K1/115 , H05K1/181 , H05K3/306 , H05K3/3447 , H05K2201/10015 , H05K2201/10431 , H05K2201/10606 , Y02E60/13
Abstract: A support apparatus for a component is provided and includes a periphery entirely disposable within a footprint of the component on a surface of a substrate, a first portion having a first surface adhesively connectable to the component, a second portion having a second surface disposable to contact the surface of the substrate in discrete sectors and defining an aperture through which leads are extendable from the component and through the substrate, and vents extending between the discrete sectors from the aperture to the periphery, and bosses disposed to protrude from the second surface and into through-holes defined in the substrate.
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5.发明公开
公开(公告)号：EP3888428A1
公开(公告)日：2021-10-06
申请号：EP19809695.0
申请日：2019-11-05
Applicant: Raytheon Company
Inventor： MARTINEZ, Sergio V. , OGORZALEK, Jeffrey R. , LOTT, Patrick J.
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